IP Library Granted Patent US 9,418,757
Granted Patent B2
US 9,418,757 · App. 14/076,751 · Granted Aug 16, 2016

Method for testing semiconductor apparatus and test system using the same

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Quick Facts
Patent No.
US 9,418,757
App. No.
14/076,751
Granted
Aug 16, 2016
Kind
B2
Abstract

This technique may include a semiconductor apparatus configured to perform data read/write operations in a test mode or a normal mode and a tester configured to simultaneously perform a data test and a leakage current test through a write operation using data read by a read operation in the normal mode after writing data into the semiconductor apparatus in the test mode.

Claims (44)

1. A method for testing a semiconductor apparatus, comprising:

performing a normal read operation by reading a data from the semiconductor apparatus;

performing a normal write operation by writing a level of a signal which is maintained in an I/O pin by the normal read operation; and

determining a result of a leakage current test of the I/O pin by performing a read operation, after the normal write operation.

2. The method according to claim 1 , further comprises:

performing a write operation on the semiconductor apparatus in a test mode before the normal read operation.

3. The method according to claim 1 , the I/O pin is allocated to a data strobe signal DQS or a data mask signal DM.

4. A test system, comprising:

a semiconductor apparatus comprises a plurality of pins, and a memory block electrically coupled with the plurality of pins, and configured to perform a leakage current test by writing a level of a signal which is maintained in any one of the plurality of pins by a previous read operation to the memory block; and

a tester configured to determine a result of the leakage current test according to a data output from the memory block.

5. The test system according to claim 4 , wherein the data output from the memory block is corresponds to the any one of the plurality of pins.

6. The test system according to claim 4 , further comprises:

a plurality of I/O circuits electrically coupled between the plurality of pins and the memory block.

7. The test system according to claim 6 , wherein each of the plurality of I/O circuits comprises:

an input buffer configured to buffer a signal applied to the any one of the plurality of pins,

an input latch configured to latch an output of the input buffer,

an output latch configured to latch a read data, and

an output driver configured to drive an output signal of the output latch and apply the driven signal to the any one of the plurality of pins.

8. The test system according to claim 6 , wherein each of the plurality of I/O circuits comprises:

an input buffer configured to buffer a signal applied to the any one of the plurality of pins, according to a reference voltage,

an input latch configured to latch an output of the input buffer,

an output latch configured to latch a read data,

an output driver configured to drive an output signal of the output latch and apply the driven signal to the any one of the plurality of pins, and

a reference voltage change unit configured to change the reference voltage in response to a control signal.

9. The test system according to claim 4 , wherein the plurality of pins comprises pins allocated to data, a pin allocated to a data strobe signal, and a pin allocated to a data mask signal.

10. The test system according to claim 9 , wherein each of the plurality of I/O circuits is configured to apply a level signal that replaces the data strobe signal or a level signal that replaces the data mask signal to a pin electrically coupled with each I/O circuit in a test mode.

11. The test system according to claim 9 , wherein each of the plurality of I/O circuits comprises:

an input buffer configured to buffer a signal applied to a pin electrically coupled with the input buffer, from among the plurality of pins, in response to a reference voltage,

an input latch configured to latch output of the input buffer as write data,

an output latch configured to latch read data, and

an output driver configured to drive a level signal or an output signal of the output latch and apply the driven signal or the output signal to the pin electrically coupled with the input buffer in response to a test mode signal.

12. The test system according to claim 9 , wherein each of the plurality of I/O circuits is configured to write the data strobe signal or the data mask signal into the memory block through a predetermined data line in a test mode.

13. The test system according to claim 9 , wherein each of the plurality of I/O circuits comprises:

a buffer configured to buffer and output the data strobe signal,

an input latch electrically coupled with a data line, and

a first switch configured to transfer output of the buffer to the input latch in response to a test mode signal.

14. The test system according to claim 13 , wherein the input latch is configured to transfer an input signal to the data line in response to an input strobe signal.

15. The test system according to claim 14 , further comprising:

a second switch configured to transfer a clock signal to the input latch as the input strobe signal in response to an activation of the test mode signal, and

a third switch configured to transfer the data strobe signal to the input latch as the input strobe signal in response to a deactivation of the test mode signal.

16. The test system according to claim 9 , wherein each of the plurality of I/O circuits comprises:

a buffer configured to buffer and output the data mask signal,

an input latch electrically coupled with a data line, and

a switch configured to transfer output of the buffer to the input latch in response to a test mode signal.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067335/0246 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 11, 2013
From: KIM, MIN CHANG
To: SK HYNIX INC.
Reel/Frame 031577/0509 →