Phase-change random access memory device and method of manufacturing the same

1. A method of manufacturing phase-change random access memory (PCRAM) device, comprising:

providing a semiconductor substrate;

foaming switching elements on the semiconductor substrate;

forming a plurality of phase-change structures on the switching elements; and

forming heat absorption layers between the plurality of phase-change structures,

wherein the forming each of the plurality of phase-change structures includes:

forming a heater material on each of the switching elements;

forming a phase-change material on the heater material;

forming an upper electrode material on the phase-change material; and

etching the heater material, the phase-change material, and the upper electrode material to form a pillar including the lower electrode, the phase-change layer, and the upper electrode.

2. The method of claim 1 , wherein, after the etching for forming the lower electrode, the phase-change layer, and the upper electrode, comprising forming an insulation layer on sidewalls of the phase-change structures.

3. The method of claim 2 , wherein the forming the heat absorption layer includes:

forming a heat absorption material for the heat absorption layer between the insulation layer; and

etching back the heat absorption material so that the heat absorption layer is recessed.

4. The method of claim 3 , wherein the heat absorption material includes at least one selected from the group consisting of metal, an alloy, metal oxynitride, oxide, and a conductive carbon compound.

5. A method of manufacturing phase-change random access memory (PCRAM) device, comprising:

providing a semiconductor substrate;

forming a switching element and a lower electrode on the semiconductor substrate;

forming a first insulating layer on sidewalls of the switching element and the lower electrode;

forming a first heat absorption layer between the first insulating layer to a height corresponding to the switching element;

forming a phase-change layer and an upper electrode on the switching element;

forming a second insulating layer on sidewalls of the phase-change layer and the upper electrode; and

forming a second heat absorption layer connected to the first heat absorption layer to a height corresponding to the lower electrode and the phase-change layer.

6. The method of claim 5 , wherein the forming a switching element and the lower electrode includes:

forming a switching element material;

forming a heater material on the switching element material; and

etching the switching element material and the heater material to form the switching element and the lower electrode in a pillar shape.

7. The method of claim 6 , wherein the forming the first heat absorption layer includes:

etching the first insulating layer so that the first insulating layer is formed on sidewalls of the switching element and the lower electrode and on an upper surface of the semiconductor substrate;

forming a first heat absorption layer above and between the first insulating layer;

etching back the first heat absorption layer so that the heat absorption layer is recessed; and

forming a sacrificial insulating layer on the first heat absorption layer adjacent to the lower electrode.

8. The method of claim 7 , wherein the first heat absorption material includes at least one selected from the group consisting of metal, an alloy, metal oxynitride, oxide, and a conductive carbon compound.

9. The method of claim 8 , wherein the forming the phase-change layer and the upper electrode includes:

forming a phase-change material on the lower electrode and the sacrificial insulating layer;

forming an upper electrode material on the phase-change material; and

etching the phase-change material and the upper electrode material to form the phase-change layer and the upper electrode in a pillar shape to expose the sacrificial insulating layer.

10. The method of claim 9 , wherein the forming the second heat absorption layer includes:

etching the second insulating layer and the sacrificial layer so that the second insulating layer is formed on sidewalls of the phase-change layer and the upper electrode and to expose the first heat absorption layer;

forming a second heat absorption material on the first heat absorption layer to connect the first heat absorption layer and the second heat absorption layer; and

etching back the second heat absorption material so that the second heat absorption layer is recessed and formed on sidewalls of the first and second insulating layer to a height corresponding to the upper surface of the phase-change layer.

11. The method of claim 10 , wherein each of the first heat absorption layer and the second heat absorption layer includes at least one selected from the group consisting of metal, an alloy, metal oxynitride, oxide, and a conductive carbon compound.