Method of fabricating semiconductor device
View Patent ↗A method of fabricating a semiconductor device includes providing a semiconductor substrate in which a lower structure is formed, forming a phase-change material layer of a first state over the lower structure, transforming an upper region of the phase-change material layer of the first state into a phase-change material layer of a second state having an etch selectivity different from the phase-change material layer of the first state, removing the phase-change material layer of the second state, and forming an upper electrode over the phase-change material layer of the first state in which the phase-change material layer of the second state is removed.
1. A method of fabricating a semiconductor device, the method comprising:
providing a semiconductor substrate in which a lower structure is formed;
forming a phase-change material layer of a first state over the lower structure;
transforming an upper region of the phase-change material layer of the first state into a phase-change material layer of a second state having an etch selectivity different from the phase-change material layer of the first state;
removing the phase-change material layer of the second state; and
forming an upper electrode over the phase-change material layer of the first state in which the phase-change material layer of the second state is removed.
2. The method of claim 1 , wherein the first state is a crystalline state, and the second state is an amorphous state.
3. The method of claim 1 , wherein the first state is an amorphous state, and the second state is a crystalline state.
4. The method of claim 1 , wherein the transforming an upper region of the phase-change material layer of the first state into the phase-change material layer of the second state includes implanting impurities into the phase-change material layer of the first state.
5. The method of claim 4 , wherein a depth of the phase-change material layer of the second state is controlled by a dose of the impurities.
6. The method of claim 1 , before forming the phase-change material layer of the first state, further comprising:
forming a hole exposing a surface of the semiconductor substrate;
forming a heating electrode in a lower portion of the hole.
7. The method of claim 6 , wherein the forming a first phase-change material layer of a first state includes:
burying a pre-phase-change material layer over the heating electrode in the hole;
forming a capping layer over a resultant structure including the pre-phase-change material layer; and
annealing the pre-phase-change material layer to be transformed into the phase-change material layer of the first state.
8. The method of claim 7 , wherein the pre-phase-change material layer has a structure in which a first width of a lower part of the pre-phase-change material layer in contact with the heating electrode is smaller than a second width of an upper part of the pre-phase-change material layer.