IP Library Granted Patent US 8,994,858
Granted Patent B2
US 8,994,858 · App. 14/083,365 · Granted Mar 31, 2015

Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic equipment

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Quick Facts
Patent No.
US 8,994,858
App. No.
14/083,365
Granted
Mar 31, 2015
Kind
B2
Abstract

A solid-state imaging device includes a photoelectric transformation portion and a micro lens, the micro lens has a first refractive index layer which is a first refractive index and a second refractive index layer which is a second refractive index different from the first refractive index, wherein the micro lens is configured so that a vertical cross section, which is a surface perpendicular to the capturing surface, has a rectangular shape, wherein each of the first refractive index layer and the second refractive index layer are arranged adjacent to each other in a direction along the capturing surface, and an interface between the first refractive index layer and the second refractive index layer in the vertical cross section is formed so as to follow a direction perpendicular to the capturing surface.

Claims (18)

1. A solid-state imaging device, comprising:

a pixel area, wherein the pixel area includes:

a plurality of pixels, wherein each of the pixels includes at least one photodiode and a micro lens,

wherein the micro lens is formed over the photodiodes of the pixels,

wherein the micro lens includes:

a first layer, wherein the first layer has a first refractive index; and

a second layer, wherein the second layer has a second refractive index that is different from the first refractive index,

wherein the pixel area has a center area and a peripheral area, and

wherein the second refractive index layer covers upper surface of the first refractive index layer, the second refractive index layer is a U shape in vertical cross section which is a surface perpendicular to a capturing surface.

2. The solid-state imaging device of claim 1 , wherein a shape of a micro lens of a pixel in the plurality of pixels in the center area is different from the shape of a micro lens of a pixel in the peripheral area.

3. The solid-state imaging device of claim 2 , wherein a pitch between centers of the first refractive index layers in a second one of the horizontal and the vertical directions is less than a pitch between centers of the pixels in the second one of the horizontal and vertical directions.

4. The solid-state imaging device of claim 3 , wherein for each of the pixels the size of an area of the first layer is the same.

5. The solid-state imaging device of claim 4 , wherein for each of the pixels the size of an area of the second layer is the same.

6. The solid-state imaging device of claim 1 , wherein the micro lens is rectangular in a horizontal plane along a capturing surface.

7. The solid-state imaging device of claim 1 , wherein for each of the pixels the size of an area of the first layer is the same.

8. The solid-state imaging device of claim 1 , wherein for each pixel in the peripheral area a center of the first layer in a horizontal cross section does not correspond to a center of the second layer in the horizontal cross section.

9. The solid-state imaging device of claim 1 , wherein the first refractive index is higher than the second refractive index.

10. The solid-state imaging device of claim 1 , wherein for at least a center pixel the first layer has a center in the horizontal cross section that corresponds to a center of the second layer in the horizontal cross section.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →