Semiconductor device
View Patent ↗A semiconductor device includes: a semiconductor substrate having a drift layer of a first conductivity type, a body layer of a second conductivity type formed on a surface of the drift layer, and a source layer formed on a portion of a surface of the body layer; a gate insulation film formed on an inner wall of a trench that extends from the surface of the semiconductor substrate through the source layer and the body layer to the drift layer; and a gate electrode housed in the trench and covered with the gate insulation film, the gate electrode including, in a region located at a drift layer side of a boundary between the body and drift layers, at least one first semiconductor layer of the first conductivity type and at least one second semiconductor layer of the second conductivity type that are alternately disposed and joined to each other.
1. A semiconductor device comprising:
a semiconductor substrate having a drift layer of a first conductivity type, a body layer of a second conductivity type formed on a surface of the drift layer, and a source layer formed on a portion of a surface of the body layer;
a gate insulation film formed on an inner wall of a trench that extends from the surface of the semiconductor substrate through the source layer and the body layer to the drift layer; and
a gate electrode housed in the trench and covered with the gate insulation film, the gate electrode including, in a region located at a drift layer side of a boundary between the body layer and the drift layer, at least one first semiconductor layer of the first conductivity type and at least one second semiconductor layer of the second conductivity type that are (1) alternately disposed, (2) joined to each other, and (3) in direct contact with each other.
2. The semiconductor device according to claim 1 , further comprising
a wiring for applying bias voltage, wherein
the at least one first semiconductor layer and the at least one second semiconductor layer are alternately disposed in a depth direction of the trench, and
the first semiconductor layer or the second semiconductor layer, which is disposed on a lowermost of the trench, is electrically connected to the wiring.
3. The semiconductor device according to claim 1 , further comprising
a wiring for applying bias voltage, wherein
the at least one first semiconductor layer and the at least one second semiconductor layer are alternately disposed in a longitudinal direction of the trench, and
the first semiconductor layer or the second semiconductor layer, which is disposed on an end in the longitudinal direction of the trench, is electrically connected to the wiring.
4. The semiconductor device according to claim 1 , further comprising
a wiring for applying bias voltage, wherein
the at least one first semiconductor layer and the at least one second semiconductor layer are alternately disposed in a direction perpendicular to a longitudinal direction of the trench, and
the first semiconductor layer or the second semiconductor layer, which is disposed on an end in the direction perpendicular to the longitudinal direction of the trench, is electrically connected to the wiring.