Endoscope

1. An endoscope comprising:

an elongated insertion portion;

a main unit to which one end of the insertion portion is attached;

first electronic components that are provided inside the insertion portion;

second electronic components that are provided inside the insertion portion and are supplied with drive power from a separate system from that used for the first electronic components;

a first substrate having a length and a thickness, the thickness of the first substrate being less than the length of the first substrate, the first electronic components being packaged on a first surface of the first substrate;

a second substrate having a length and a thickness, the thickness of the second substrate being less than the length of the second substrate, the second electronic components being packaged on a first surface of the second substrate;

a plurality of power limiting portions that limit to a predetermined value or less a drive power that they supply to the first electronic components and the second electronic components respectively via mutually different systems;

a first wiring of which at least a portion is placed inside the insertion portion, and that electrically connects together one of the power limiting portions and the first electronic components and supplies the drive power to the first electronic components;

a second wiring of which at least a portion is placed inside the insertion portion, and that electrically connects together another of the power limiting portions and the second electronic components and supplies the drive power to the second electronic components; and

a solid ground pattern formed either on a second surface of the first substrate which is located opposite to the first surface of the first substrate or inside the first substrate and that, when viewed along the length of the first substrate, the solid ground pattern extends over a broader area than the first electronic components.

2. The endoscope according to claim 1 , wherein:

the first substrate and the second substrate are integrated into a multi-layer substrate by mutually superimposing the first substrate and the second substrate in the thickness direction of the first and second substrates; and

the ground pattern is interposed between the first electronic components and second electronic components.

3. The endoscope according to claim 1 , wherein:

the first substrate and the second substrate are defined by first and second sections of a continuous flexible substrate located in the insertion portion;

the first electronic components and the second electronic components are packaged on the first and second sections of the continuous flexible substrate; and

the flexible substrate is folded in half at a location between the first electronic components and the second electronic components such that the ground pattern is positioned between the first electronic components.

4. The endoscope according to claim 1 , wherein:

a metal supporting body is provided at a distal end side of the insertion portion and supports the first substrate and the second substrate; and

the ground of the first electronic components and the second electronic components is electrically connected to the supporting body; and

the first electronic components and the second electronic components are thermally connected to the supporting body.