IP Library Granted Patent US 9,740,248
Granted Patent B2
US 9,740,248 · App. 14/089,991 · Granted Aug 22, 2017

Component placement within a solid state drive

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,740,248
App. No.
14/089,991
Granted
Aug 22, 2017
Kind
B2
Abstract

A component mount for a data storage device (DSD). The component mount includes a flexible member or printed circuit board assembly (PCBA) including a pad for electrically connecting to a printed circuit board (PCB) of the DSD. At least one capacitor is mounted on the flexible member or PCBA, and is electrically connected with the pad.

Claims (28)

1. A component mount for a data storage device (DSD) comprising:

a flexible member including a top side, a bottom side, a main portion, an extension portion extending from the main portion, and a pad for electrically connecting to a printed circuit board (PCB) of the DSD, wherein:

the pad is disposed on the extension portion,

the extension portion includes a hole for alignment of the component mount, and

the hole includes a non-circular portion; and

a capacitor disposed on the top side of the flexible member and electrically connected with the pad.

2. The component mount of claim 1 , wherein the extension portion extends longitudinally from the main portion.

3. The component mount of claim 2 , wherein the pad is located adjacent a length of the main portion such that the pad is adjacent the capacitor.

4. The component mount of claim 1 , wherein the main portion includes a hole for securing the component mount.

5. The component mount of claim 1 , further comprising a second capacitor disposed on the bottom side of the flexible member.

6. The component mount of claim 1 , further comprising a compression connector on the flexible member.

7. The component mount of claim 1 , further comprising a pressure sensitive adhesive on the bottom side of the flexible member.

8. A data storage device (DSD) comprising:

a base casting defining an area having a first portion and a second portion;

a printed circuit board (PCB) disposed within the base casting and occupying the first portion of the area; and

a component mount disposed within the base casting, occupying the second portion of the area, the component mount comprising:

a main portion;

an extension portion connected to the main portion and including a pad for electrically connecting to the PCB; and

a capacitor disposed on the main portion and electrically connected with the pad.

9. The DSD of claim 8 , wherein the main portion comprises a flexible member.

10. The DSD of claim 8 , wherein the main portion comprises a printed circuit board assembly (PCBA).

11. The DSD of claim 8 , wherein the PCB includes at least one component mounted on the PCB such that the PCB with the component mounted thereon has a first height within the base casting, and wherein the component mount has a second height within the base casting that is substantially equal to the first height.

12. The DSD of claim 8 , wherein the capacitor is disposed on a top side of the main portion and a second capacitor is disposed on a bottom side of the main portion.

13. The DSD of claim 8 , wherein the main portion further comprises a hole, the hole located near a corner of the base casting for aligning the component mount within the base casting.

14. The DSD of claim 8 , further comprising a compression connector under the PCB and configured to contact the pad to electrically connect the pad to the PCB.

15. The DSD of claim 8 , further comprising a compression connector over the pad of the extension portion and configured to contact the PCB to electrically connect the pad to the PCB.

16. The DSD of claim 8 , wherein the component mount further comprises a pressure sensitive adhesive for connecting to the base casting.

17. The DSD of claim 8 , wherein the base casting further comprises a shock absorbing layer.

Assignments (7)
RELEASE OF SECURITY INTEREST AT REEL 038744 FRAME 0481 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0556 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 045501/0714 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0481 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0281 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038722/0229 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2014
From: SARRAF, MOHAMMAD; VU, BILLY HUNG; MYERS, JOHN P.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 033031/0653 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2014
From: SARRAF, MOHAMMAD; VU, BILLY HUNG; MYERS, JOHN P.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 032868/0306 →