Method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface
View Patent ↗In order to provide a novel method for producing a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the characteristic of the present disclosure lies in that the obverse surface of the chip having a hydroxyl group is brought into contact with an organic solvent in which R 1 —Si(OR 2 ) 3 or R 1 —SiY 3 is dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip.
1. A method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the method comprising:
(a) preparing a first substrate comprising the chip on the reverse surface thereof through a wax film;
wherein the chip comprises an obverse surface and a reverse surface;
the obverse surface of the chip is in contact with the wax film 830 ;
the reverse surface of the chip is hydrophilic;
(b) bringing the reverse surface of the chip into contact with a second substrate having a water film on the obverse surface thereof to obtain a laminate composed of the first substrate and the second substrate;
wherein the reverse surface of the chip is brought into contact with the water film;
(c) immersing the laminate in a first hydrophobic solvent to dissolve the wax film in the first hydrophobic solvent;
(d) removing the first substrate to obtain the second substrate where the chip is attached on the obverse surface thereof;
wherein the reverse surface of the chip is in contact with the water film; and
the obverse surface of the chip is exposed;
(e) bringing the obverse surface of the chip having a hydroxyl group into contact with an organic solvent in which R 1 —Si(OR 2 ) 3 or R 1 —SiY 3 is dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip; wherein
R 1 represents a hydrocarbon group or a fluorinated hydrocarbon group;
R 2 represents an alkoxy group; and
Y represents halogen; and
(f) removing the second substrate to obtain the chip having the water-repellent obverse surface and the hydrophilic reverse surface.
2. The method according to claim 1 , wherein the wax film is adhesive.
3. The method according to claim 1 , wherein the first hydrophobic solvent is butyl acetate, ethyl acetate, chloroform, toluene, or the mixture thereof.
4. The method according to claim 1 , wherein in the step (e), the second substrate where the chip is attached on the obverse surface thereof is immersed in the organic solvent.
5. The method according to claim 1 , wherein the second hydrophobic solvent is hydrocarbon having a carbon number of not less than 6, butyl acetate, ethyl acetate, chloroform, or the mixture thereof.
6. A method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the method comprising:
(a) preparing a first substrate comprising the chip on the reverse surface thereof through a wax film;
wherein the chip comprises an obverse surface and a reverse surface;
the obverse surface of the chip is in contact with the wax film;
the reverse surface of the chip is hydrophilic;
(b) bringing the reverse surface of the chip into contact with a second substrate having a water film on the obverse surface thereof to obtain a laminate composed of the first substrate and the second substrate;
wherein the reverse surface of the chip is brought into contact with the water film;
(c) immersing the laminate in a first hydrophobic solvent to dissolve the wax film in the first hydrophobic solvent;
(d) removing the first substrate to obtain the second substrate where the chip is attached on the obverse surface thereof;
wherein the reverse surface of the chip is in contact with the water film; and
the obverse surface of the chip is exposed;
(e) bringing the obverse surface of the chip having gold into contact with an organic solvent in which Ri—SH is dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip;
wherein R 1 represents a hydrocarbon group or a fluorinated hydrocarbon group; and
(f) removing the second substrate to obtain the chip having the water-repellent obverse surface and the hydrophilic reverse surface.
7. The method according to claim 6 , wherein the wax film is adhesive.
8. The method according to claim 6 , wherein the first hydrophobic solvent is butyl acetate, ethyl acetate, chloroform, toluene, or the mixture thereof.
9. The method according to claim 6 , wherein in the step (e), the second substrate where the chip is attached on the obverse surface thereof is immersed in the organic solvent.
10. The method according to claim 6 , wherein the second hydrophobic solvent is hydrocarbon having a carbon number of not less than 6, butyl acetate, ethyl acetate, chloroform, or the mixture thereof.