THERMALLY CONDUCTIVE FLAME RETARDANT POLYMER COMPOSITIONS AND USES THEREOF
Disclosed herein is a thermally conductive composition, comprising 20 to 80 wt % of a thermoplastic or thermosetting polymer; 10 to 70 wt % of a metal hydroxide; and a polymeric char forming agent, where the polymeric char forming agent provides the thermally conductive composition with a flame retardancy of V-0 at a thickness of 1.5 millimeters or less when tested as per a UL-94 testing protocol; where the weight percents are based on a total weight of the thermally conductive composition.
1 . A thermally conductive composition, comprising:
20 to 80 wt % of a thermoplastic or thermosetting polymer;
10 to 70 wt % of a metal hydroxide; and
0.5 to 10 wt % a polymeric char forming agent, where the polymeric char forming agent provides the thermally conductive composition with a flame retardancy of V-0 at a thickness of 1.5 millimeter or less when tested as per a UL-94 testing protocol; and where the weight percents are based on a total weight of the thermally conductive composition.
2 . The thermally conductive composition of claim 1 , further comprising 5 to 60 wt % of a filler or a reinforcing agent, or a combination comprising at least one of the foregoing.
3 . The thermally conductive composition of claim 1 , wherein the thermoplastic polymer is a polypropylene, a polyethylene, an ethylene based copolymer, a polyamide, a polyester, a polybutylene terephthalate, a polyethylene terephthalate, a polycyclohexylenedimethylene terephthalate, a polystyrene, a modified high impact polystyrene, a (meth)acryl polymer, a polyurethane, or a combination comprising at least one of the foregoing thermoplastic polymers.
4 . The thermally conductive composition of claim 1 , where the polymeric char-forming agent is an organic polymer that comprises an aromatic group.
5 . The thermally conductive composition of claim 4 , wherein the organic polymer that comprises an aromatic group is a poly(arylene ether), a polyetherimide, a polyetherimide/polyimide copolymer, a polycarbonate, a polysulfone, a polyethersulfone, a polyetheretherketone, a polyetherketone, a polyketone, or a combination comprising at least one of the foregoing polymeric char-forming agents.
6 . The thermally conductive composition of claim 1 , wherein the metal hydroxide is Mg(OH) 2 , γ-AlO(OH), α-AlO(OH), Al(OH) 3 or a combination comprising at least one of the foregoing metal hydroxides.
7 . The thermally conductive composition of claim 2 , where the reinforcing agent comprises glass fibers.
8 . The thermally conductive composition of claim 7 , wherein the filler or reinforcing agent has a thermal conductivity greater than or equal to 50 W/mK, and comprises AlN, Al 4 C 3 , Al 2 O 3 , BN, AlON, MgSiN 2 , SiC, Si 3 N 4 , graphite, expanded graphite, graphene, carbon fiber, or a combination comprising at least one of the foregoing reinforcing agents; the filler or reinforcing agent has a thermal conductivity of 10 to 30 W/mK, and comprises ZnS, CaO, MgO, ZnO, TiO 2 , or a combination comprising at least one of the foregoing reinforcing agents; or the filler or reinforcing agent has a thermal conductivity less than 10 W/mK, and comprises CaCO 3 , mica, BaO, BaSO 4 , CaSiO 3 , ZrO 2 , SiO 2 , glass beads, glass fiber, MgO.xAl 2 O 3 , CaMg(CO 3 ) 2 , H 2 Mg 3 (SiO 3 ) 4 , ceramic-coated graphite, clay, or a combination comprising at least one of the foregoing reinforcing agents.
9 . The thermally conductive composition of claim 1 , wherein the composition further comprises from 1 to 10% by weight of a pigment, a processing additive, or a combination comprising at least one of the foregoing additives.
10 . The thermally conductive composition of claim 1 , wherein the thermosetting polymer is an epoxy polymer, an unsaturated polyester polymer, a polyimide polymer, a bismaleimide polymer, a bismaleimide triazine polymer, a cyanate ester polymer, a vinyl polymer, a benzoxazine polymer, a benzocyclobutene polymer, a (meth)acryl polymer, an alkyd polymer, a phenol-formaldehyde polymer, a novolac polymer, a resole polymer, a melamine-formaldehyde polymer, a urea-formaldehyde polymer, a hydroxymethylfuran polymer, an isocyanate polymer, a diallyl phthalate polymer, a triallyl cyanurate polymer, a triallyl isocyanurate polymer, an unsaturated polyesterimide, or a combination comprising at least one of the foregoing thermosetting polymers.
11 . The thermally conductive composition of claim 1 , where the thermoplastic polymer is present in an amount of 20 to 50 wt %, based on the total weight of the thermally conductive composition and where the thermoplastic polymer is a polyamide, a polyester, or a polyolefin.
12 . The thermally conductive composition of claim 1 , further comprising a silicone char forming agent.
13 . The thermally conductive composition of claim 12 , further comprising a chain extender.
14 . An article comprising the composition of claim 1 .
15 . A thermally conductive composition, comprising:
20 to 80 wt % of a thermoplastic or thermosetting polymer;
10 to 70 wt % of a metal hydroxide; and
0.5 to 10 wt % of a polymeric char-forming agent, wherein the thermally conductive composition has a thermal conductivity of at least 0.5 W/mK for through plane thermal conductivity; and a flame retardancy of at least V-0 performance at a thickness of 1.5 mm or less when tested as per a UL94 testing standard; where the weight percents are based on a total weight of the thermally conductive composition.
16 . The thermally conductive composition of claim 15 , further comprising 5 to 60 wt % of a filler or a reinforcing agent, or a combination comprising at least one of the foregoing.
17 . The thermally conductive composition of claim 16 , wherein the filler or reinforcing agent has a thermal conductivity greater than or equal to 50 W/mK, and comprises AN, Al 4 C 3 , Al 2 O 3 , BN, AlON, MgSiN 2 , SiC, Si 3 N 4 , graphite, expanded graphite, graphene, carbon fiber, or a combination comprising at least one of the foregoing reinforcing agents; the filler or reinforcing agent has a thermal conductivity of 10 to 30 W/mK, and comprises ZnS, CaO, MgO, ZnO, TiO 2 , or a combination comprising at least one of the foregoing reinforcing agents; or the filler or reinforcing agent has a thermal conductivity less than 10 W/mK, and comprises CaCO 3 , mica, BaO, BaSO 4 , CaSiO 3 , ZrO 2 , SiO 2 , glass beads, glass fiber, MgO.xAl 2 O 3 , CaMg(CO 3 ) 2 , H 2 Mg 3 (SiO 3 ) 4 , ceramic-coated graphite, clay, or a combination comprising at least one of the foregoing reinforcing agents.
18 . The thermally conductive composition of claim 15 , where the thermoplastic polymer is present in an amount of 20 to 50 wt %, based on the total weight of the thermally conductive composition and where the thermoplastic polymer is a polyamide, a polyester or a polyolefin.
19 . A method comprising:
blending 20 to 80 wt % of a thermoplastic or thermosetting polymer; 10 to 70 wt % of a metal hydroxide; 0.5 to 2 wt % of an anti-flame dripping agent, 0.5 to 10 wt % of a polymeric char-forming agent, wherein the thermally conductive composition has a thermal conductivity of at least 0.5 W/mK for through plane thermal conductivity; and a flame retardancy of at least V-0 performance at a thickness of 1.5 mm or less when tested as per a UL94 testing standard; where the weight percents are based on a total weight of the thermally conductive composition.
20 . The method of claim 19 , where the blending is effected in an extruder.
21 . The method of claim 19 , further comprising molding the thermally conductive composition.