System and method for deposition of a material on a substrate

1. A method for improving film uniformity on a substrate comprising:

placing a first substantially flat surface opposite a nozzle and in a void region between elements of a transport mechanism;

placing a second substantially flat surface in a second void region between elements of a transport mechanism and adjacent to the first substantially flat surface,

wherein the first and second substantially flat surfaces are supported by a bar located below the first and second substantially flat surfaces and are connected to the bar with respective adjustable connectors;

placing an exhaust basket substantially directly beneath the first substantially flat surface;

connecting the exhaust basket to a source of reduced pressure, the exhaust basket having an intake, the intake positioned beneath the nozzle and the first and second substantially flat surfaces; and

introducing a vapor through the nozzle toward the first and second substantially flat surfaces;

wherein the exhaust basket is configured to receive a portion of the vapor from the nozzle.

2. The method of claim 1 , wherein the vapor is introduced at atmospheric pressure.

3. The method of claim 1 , wherein the vapor is introduced at a pressure above atmospheric pressure.

4. The method of claim 1 , wherein the vapor is introduced at a pressure below atmospheric pressure.

5. The method of claim 1 , wherein a plane tangential to the transport mechanism is offset between 0.1 to 10 mm from the first substantially flat surface.

6. The method of claim 1 , wherein the first and second substantially flat surfaces are adjustably connected to the bar through the respective adjustable connectors.

7. The method of claim 1 , wherein placing the second substantially flat surface in a second void region further comprises placing the second substantially flat surface opposite a second nozzle.

8. A method of reducing edge effects in vapor deposition comprising:

introducing at least one substantially flat surface in between portions of a substrate transport mechanism and opposite a deposition nozzle,

wherein a position of the at least one substantially flat surface is adjustable, and

wherein the at least one substantially flat surface is supported by a bar located below the at least one substantially flat surface and is connected to the bar with a respective adjustable connector.

9. The method of claim 8 , further comprising introducing an exhaust basket beneath the at least one substantially flat surface and connecting the exhaust basket to a source of reduced pressure.

10. The method of claim 8 , wherein the position of the at least one substantially flat surface is set such that a plane tangential to the transport mechanism is offset between 0.1 to 10 mm from the at least one substantially flat surface.

11. A method of reducing edge effects in vapor deposition comprising:

introducing at least one substantially flat surface in between portions of a substrate transport mechanism,

wherein the at least one substantially flat surface is supported by a bar located below the at least one substantially flat surface and is connected to the bar with a respective adjustable connector, and wherein the substantially flat surface extends beyond the width of a substrate when present.