IP Library › Granted Patent US 9,331,047
Granted Patent B2
US 9,331,047 · App. 14/092,407 · Granted May 3, 2016

Mounting method and mounting structure for semiconductor package component

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Quick Facts
Patent No.
US 9,331,047
App. No.
14/092,407
Granted
May 3, 2016
Kind
B2
Abstract

A semiconductor package component ( 3 ) is mounted on a substrate ( 1 ) in such a manner that an electrode ( 2 ) of the substrate ( 1 ) and an electrode of the semiconductor package component ( 3 ) are brought into contact with each other through a joining material ( 4 ). A reinforcing adhesive ( 5 c ) is applied between the substrate ( 1 ) and the outer surface of the semiconductor package component ( 3 ). Then, reflow is performed to melt the joining metal ( 4 ) with the reinforcing adhesive ( 5 c ) uncured. After the reinforcing adhesive ( 5 c ) is cured, the joining metal ( 4 ) is solidified.

Claims (6)

1. A semiconductor package component mounting method comprising:

mounting a semiconductor package component on a substrate in such a manner that an electrode of the substrate and an electrode of the semiconductor package component are brought into contact with each other through a solidified joining metal;

applying a reinforcing adhesive between a periphery of an area on the substrate where the semiconductor package component is mounted and an outer surface of the semiconductor package component in such a manner that the reinforcing adhesive does not contact the joining metal; and

performing reflow by successively heating to pass a curing start temperature of the reinforcing adhesive, melting the joining metal after passing a curing peak temperature of the reinforcing adhesive, raising the temperature of the reinforcing adhesive until the reinforcing adhesive is cured with the joining metal being in a molten state when the curing of the reinforcing adhesive is completed, and lowering the temperature to solidify the joining metal.

2. The semiconductor package component mounting method according to claim 1 , wherein, in the applying of the reinforcing adhesive, the reinforcing adhesive is applied so that the reinforcing adhesive extends from a surface of the semiconductor package component opposite a surface facing the substrate to the substrate.

3. The semiconductor package component mounting method according to claim 1 , wherein, in the applying of the reinforcing adhesive, the reinforcing adhesive is applied so that the reinforcing adhesive extends from an end face of the semiconductor package component to the substrate, the end face connecting a surface of the semiconductor package component facing the substrate and a surface opposite the surface.