Method to enhance reliability of through mold via TMVA part on part POP devices
View Patent ↗A Through Mold Via (TMV) Integrated Circuit (IC) package is provided as a bottom IC package for a TMV Package on Package (POP) configuration. The TMV IC package has an overmold top portion having a substantially flat surface and spacer or standoff features extending upward from the flat surface. The spacer or standoff features are configured to abut the bottom surface of the top POP package during softer reflow in order to maintain a gap of predetermined height between the top and bottom IC packages.
1. A method of manufacturing a Through Mold Via (TMV) package, the method comprising:
providing a chip carrier having a top side and a bottom side;
electrically connecting an integrated circuit (IC) onto the top side of the chip carrier;
attaching solder balls to the top side of the chip carrier and about the IC;
over molding the top side of the chip carrier, the integrated circuit and the solder balls with an over molded portion, the over molded portion comprising:
a primary over molded portion substantially covering the top side of the chip carrier, the IC and the solder balls, the primary over molded portion further comprising a substantially flat top surface; and
a spacer over molded portion comprising at least one spacer feature extending a predetermined height above the flat top surface; and
ablating over molded material to expose the solder balls.
2. The method of manufacturing of claim 1 , wherein the primary over molded portion and the spacer over molded portion are created in a single over molding step.
3. The method of manufacturing of claim 1 , wherein the predetermined height is between about 2 mills and about 5 mils.
4. The method of manufacturing of claim 1 , wherein each spacer feature comprises a shaped bump.
5. The method of manufacturing of claim 1 , wherein the spacer feature comprises an elongate shaped bump.