IP Library Granted Patent US 9,295,184
Granted Patent B2
US 9,295,184 · App. 14/094,066 · Granted Mar 22, 2016

Scalable and modular approach for power electronic building block design in automotive applications

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,295,184
App. No.
14/094,066
Granted
Mar 22, 2016
Kind
B2
Abstract

A power electronic building block includes a housing; a power module mounted within the housing; a controller mounted within the housing and coupled to the power module; a capacitor assembly coupled to the power module and mounted within the housing; an AC bus bar mounted within the housing; and a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.

Claims (38)

1. A power electronic building block, comprising:

a housing having a base and walls extending generally perpendicularly from the base, the walls including a first set of walls enclosing a first section on the base of the housing and a second set of walls enclosing a second section on the base of the housing, the first set of walls being laterally offset from the second set of walls on the base;

a power module mounted on the base within the first section of the housing;

a controller mounted within the housing and coupled to the power module;

a capacitor assembly coupled to the power module and mounted on the base within the second section of the housing;

an AC bus bar mounted within the housing; and

a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing.

2. The power electronic building block of claim 1 , further comprising a heat sink mounted to an underside of the power module.

3. The power electronic building block of claim 2 , wherein the heat sink is mounted on the housing.

4. The power electronic building block of claim 3 , wherein the heat sink has a first side with a generally planar surface and a second side with pins, and wherein the housing defines an opening such that the first side of the heat sink covers the opening and contacts the power module and the pins extend away from the housing.

5. The power electronic building block of claim 4 , further comprising fully sintered interconnects between the heat sink and the power module.

6. The power electronic building block of claim 1 , further comprising a current sensor configured to monitor current from the power module and to generate control signals for the controller.

7. The power electronic building block of claim 6 , wherein the current sensor is housed within the housing.

8. The power electronic building block of claim 1 , wherein the DC bus bar is positioned over the capacitor assembly to cover the second section and positioned over the power module to at least partially cover the first section.

9. The power electronic building block of claim 8 , wherein the second section includes a first set of fastening holes and wherein the DC bus bar is secured to the housing via a first set of fasteners extending through the DC bus bar into the first set of fastening holes.

10. A power electronic building block, comprising:

a housing;

a power module mounted within the housing;

a controller mounted within the housing and coupled to the power module;

a capacitor assembly coupled to the power module and mounted within the housing;

an AC bus bar mounted within the housing; and

a DC bus bar coupling the capacitor assembly to the power module and mounted within the housing,

wherein the housing has a base and walls extending generally perpendicularly from the base, wherein the power module and the capacitor assembly are arranged on the base of the housing, and wherein the walls form a first section surrounding the power module and a second section surrounding the capacitor assembly,

wherein the DC bus bar is positioned over the capacitor assembly to cover the second section and positioned over the power module to at least partially cover the first section, wherein the second section includes a first set of fastening holes, and wherein the DC bus bar is secured to the housing via a first set of fasteners extending through the DC bus bar into the first set of fastening holes, and

wherein the AC bus bar is positioned over the first section to cover the power module and at least a portion of the DC bus bar.

11. The power electronic building block of claim 10 , wherein the first section includes a second set of fastening holes, and wherein the AC bus bar is secured to the housing via a second set of fasteners extending through the AC bus bar into the second set of fastening holes.

12. The power electronic building block of claim 11 , wherein the housing further defines a third section, wherein the power electronic building block further comprises a hall effect sensor arranged in the third section, and wherein the AC bus bar covers the third section and the hall effect sensor.

13. The power electronic building block of claim 12 , wherein the controller is positioned over at least portions of the AC bus bar, the DC bus bar, and the power module.

14. The power electronic building block of claim 13 , wherein the housing includes a third set of fastening holes, and wherein the controller is secured to the housing via a third set of fasteners extending through the controller into the third set of fastening holes.

15. A method for forming a power electronic building block, comprising the steps of:

positioning, via press fitting, a power module within a first section of a housing;

positioning, via press fitting, a capacitor assembly within a second section of the housing;

positioning, via press fitting, a current sensor within a third section of the housing;

mounting a DC bus bar on the housing over the first section and the second section and coupling the DC bus bar to the power module and the capacitor assembly via press fitting;

mounting an AC bus bar on the housing over the second section and over the third section and the current sensor and coupling the AC bus bar to the power module via press fitting; and

mounting a controller over at least portions of the power module, the DC bus bar, and the AC bus bar.

16. The method of claim 15 , further comprising the step of:

attaching the DC bus bar, the AC bus bar, and the controller to the housing via fasteners.

Assignments (4)
CONFIRMATORY LICENSE Recorded Jun 2, 2016
From: GENERAL MOTORS, LLC
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 038990/0330 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2014
From: WILMINGTON TRUST COMPANY
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 034189/0065 →
SECURITY INTEREST Recorded Jun 12, 2014
From: GM GLOBAL TECHNOLOGY OPERATIONS LLC
To: WILMINGTON TRUST COMPANY
Reel/Frame 033135/0440 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2013
From: KORICH, MARK D.; GROSU, VICENTIU; TANG, DAVID; SMITH, GREGORY S.; TRIANTOS, KONSTANTINOS
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 031747/0948 →