IP Library Granted Patent US 9,615,794
Granted Patent B2
US 9,615,794 · App. 14/094,860 · Granted Apr 11, 2017

Method, devices and systems for sensor with removable nodes

Inventors: Kenneth Kaskoun (La Jolla, CA); Brian David Niznik (San Diego, CA); Michael David Atella (San Diego, CA)
Assignee: QUALCOMM Incorporated
A61B5/6833A61B5/0002A61B5/11A61B5/1112A61B5/684A61B5/742A61B5/7405
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Quick Facts
Patent No.
US 9,615,794
App. No.
14/094,860
Granted
Apr 11, 2017
Kind
B2
Abstract

An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the detachable sensor pod and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.

Claims (33)

1. An integrated adhesive sensor array for measuring a physical or physiological parameter of a body, comprising:

a patch;

a sensor hub coupled to the patch; and

a detachable sensor pod detachably coupled to the patch,

wherein:

the patch comprises:

a flexible adhesive substrate configured to adhere the patch and sensor hub coupled to the patch directly to the body;

a flexible layer integrated with the flexible adhesive substrate, the flexible layer supporting the sensor hub and sensor hub wiring coupled to the sensor hub; and

a docking area where the detachable sensor pod is detachably coupled, the docking area including a connector coupled to the sensor hub wiring;

the sensor hub comprises:

a wireless transceiver;

a first energy storage element; and

a processor coupled to the wireless transceiver, the sensor hub wiring, and the first energy storage element, wherein the processor is configured with processor-executable instructions to perform operations comprising establishing a first wireless communication link with a receiver when the sensor hub is within range of the receiver; and

the detachable sensor pod comprises:

a sensor;

a second energy storage element; and

a transmitter coupled to the sensor, and the second energy storage element,

wherein the detachable sensor pod is configured such that:

the detachable sensor pod is coupled to and is powered by the sensor hub through a connection to the connector coupled to the sensor hub wiring on the patch when the detachable sensor pod is attached to the docking area;

the detachable sensor pod transmits sensor data to the sensor hub via a second wireless communication link established between the transmitter of the detachable sensor pod and the sensor hub wireless transceiver when the of detachable sensor pod is detached from the docking area.

2. The integrated adhesive sensor array of claim 1 , wherein:

the sensor hub further comprises a first indicator coupled to the processor; and

the processor is configured with processor-executable instructions to perform operations comprising providing a first indication on the first indicator when the first wireless communication link is established with a receiver.

3. The integrated adhesive sensor array of claim 2 , wherein the processor is configured with processor-executable instructions to perform operations further comprising providing a second indication on the first indicator regarding proper placement of the detachable sensor pod on a body when the detachable sensor pod is detached from the docking area.

4. The integrated adhesive sensor array of claim 3 , wherein the first indicator is configured to provide a first version of the second indication when a placement criterion is satisfied and a second version of the second indication when the placement criterion is not satisfied.

5. The integrated adhesive sensor array of claim 4 , wherein the first version of the second indication is a green display and the second version of the second indication is a red display.

6. The integrated adhesive sensor array of claim 1 , wherein the docking area is disposed on a protrusion of the flexible substrate and the flexible integrated layer configured to enable the integrated sensor array to be affixed to a surface having an irregular contour.

7. The integrated adhesive sensor array of claim 6 , wherein the protrusion is further configured to distribute a force generated by removing the detachable sensor pod from the docking area in order to resist tearing.

8. The integrated adhesive sensor array of claim 3 , wherein the detachable sensor pod is configured such that the second indication, which is provided on the first indicator regarding proper placement of the detachable sensor pod on a body, is provided by comparing a signal from the sensor of the detachable sensor pod to a threshold value of an acceptable sensor signal and generating the second indication when the sensor signal satisfies the threshold value based on the comparing.

9. The integrated adhesive sensor array of claim 3 , wherein the detachable sensor pod further comprises a second indicator and the detachable sensor pod is configured to provide a third indication via the second indicator regarding proper placement of the detachable sensor pod on a body by:

determining a current location of the detachable sensor pod with respect to the body;

comparing the current location of the detachable sensor pod with respect to the body to a proper placement location for the detachable sensor pod; and

providing the third indication via the second indicator based on whether the current location of the detachable sensor pod compares favorably to the proper placement location for the detachable sensor pod.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Mar 4, 2021
From: TC LENDING, LLC
To: CAPSULETECH, INC.; CAPSULE TECHNOLOGIES, INC.
Reel/Frame 056455/0263 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2020
From: CAPSULE TECHNOLOGIES, INC.
To: PHILIPS HEALTHCARE INFORMATICS, INC.
Reel/Frame 053262/0405 →
RELEASE OF THE SECURITY INTEREST RECORDED AT REEL/FRAME 048301/0269 Recorded Apr 17, 2020
From: TC LENDING, LLC, AS COLLATERAL AGENT
To: CAPSULE TECHNOLOGIES, INC.
Reel/Frame 052434/0262 →
CHANGE OF NAME Recorded Feb 15, 2019
From: QUALCOMM LIFE, INC.
To: CAPSULE TECHNOLOGIES, INC.
Reel/Frame 048356/0787 →
SECURITY INTEREST Recorded Feb 11, 2019
From: CAPSULE TECHNOLOGIES, INC.; CAPSULETECH, INC.
To: TC LENDING, LLC
Reel/Frame 048301/0269 →
PATENT ASSIGNMENT EFFECTIVE AS OF 02/11/2019 Recorded Feb 11, 2019
From: QUALCOMM INCORPORATED
To: QUALCOMM LIFE, INC.
Reel/Frame 048301/0902 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2013
From: KASKOUN, KENNETH; NIZNIK, BRIAN DAVID; ATELLA, MICHAEL DAVID
To: QUALCOMM INCORPORATED
Reel/Frame 031702/0872 →
Continuity (1)
Related Publication 20150150505A1 · Jun 4, 2015