Polishing agent and polishing method
View Patent ↗A polishing agent for polishing a non-oxide single-crystal substrate such as a silicon carbide single-crystal substrate with a high polishing rate to obtain a smooth surface is provided. This polishing agent comprises an oxidant having redox potential of 0.5 V or more and containing a transition metal, silicon oxide particles, cerium oxide particles and a dispersion medium, in which a mass ratio of the silicon oxide particles to the cerium oxide particles is from 0.2 to 20.
1. A polishing agent for chemically and mechanically polishing a non-oxide single-crystal substrate, the polishing agent comprising:
an oxidant having redox potential of 0.5 V or more and containing a transition metal;
silicon oxide particles and cerium oxide particles; and
a dispersion medium,
wherein the oxidant is permanganate ion, and a mass ratio of the silicon oxide particles to the cerium oxide particles is from 0.2 to 20.
2. The polishing agent according to claim 1 , wherein a content of permanganate ion is 0.015 mass % or more and 5 mass % or less.
3. The polishing agent according to claim 1 , wherein a content of the cerium oxide particles is 0.05 mass % or more and 15 mass % or less.
4. The polishing agent according to claim 1 , wherein an average secondary particle diameter of the cerium oxide particles is 0.5 μm or less.
5. The polishing agent according to claim 1 , wherein an average secondary particle diameter of the silicon oxide particles is 0.5 μm or less.
6. The polishing agent according to claim 1 , wherein the silicon oxide particle is colloidal silica.
7. The polishing agent according to claim 1 , wherein pH is 11 or less.
8. The polishing agent according to claim 7 , wherein pH is 5 or less.
9. The polishing agent according to claim 1 , wherein the non-oxide single-crystal substrate is a silicon carbide (SiC) single-crystal substrate or a gallium nitride (GaN) single-crystal substrate.
10. A polishing method comprising:
supplying the polishing agent according to claim 1 to a polishing pad;
bringing a surface to be polished of a non-oxide single-crystal substrate being a polishing object into contact with the polishing pad; and
polishing by a relative movement between the surface to be polished and the polishing pad.
11. The polishing agent according to claim 1 , wherein the oxidant is permanganate ion and is present in an amount of from 0.015 mass % to 5 mass %,
the cerium oxide particles have an average secondary particle diameter of 0.5 μm or less and are present in an amount of 0.05 mass % to 15 mass %., and
the silicon oxide is colloidal silica and the silicon oxide particles have an average secondary particle diameter of 0.5 μm or less.
12. The polishing agent according to claim 11 , wherein the permanganate ion is present in an amount of from 0.02 mass % nor to 4 mass %.
13. The polishing agent according to claim 11 , wherein the permanganate ion is present in an amount of from 0.05 mass % to 3 mass %.
14. The polishing agent according to claim 11 , wherein the cerium oxide particles are present in an amount of from 0.2 mass % to 3 mass %.
15. The polishing agent according to claim 11 , having a pH of 3 or less.
16. The polishing agent according to claim 1 , having a pH of 5 or less.