IP Library Granted Patent US 8,988,819
Granted Patent B2
US 8,988,819 · App. 14/097,243 · Granted Mar 24, 2015

Hard disk drive module having temperature detecting function

Inventors: Kang Wu (Shenzhen, CN); Bo Tian (Shenzhen, CN)
Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
G11B33/144G11B33/124
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Quick Facts
Patent No.
US 8,988,819
App. No.
14/097,243
Granted
Mar 24, 2015
Kind
B2
Abstract

A hard disk drive module comprises a hard disk drive, a bracket, a hard disk drive backplane, and a temperature detecting circuit. The bracket supports the hard disk drive. The hard disk drive backplane is electrically connected to the hard disk drive. The temperature detecting circuit comprises a temperature detecting chip arranged on the bracket, and a cable connected between the temperature detecting chip and the hard disk drive backplane.

Claims (26)

1. A hard disk drive module, comprising:

a hard disk drive;

a bracket supporting the hard disk drive;

a hard disk drive backplane electrically connected to the hard disk drive; and

a temperature detecting circuit comprising a temperature detecting chip arranged on the bracket to detect a temperature of a front side of the hard disk drive opposite to the hard disk drive backplane and a cable connected between the temperature detecting circuit and the hard disk drive backplane; and

wherein the temperature detecting chip comprises three address pins, one of the three address pin is grounded via a first resistor, and the other two of the three address pins are electrically connected to a power source via a second resistor and a third resistor, respectively.

2. The hard disk drive module of claim 1 , wherein one end of the cable is electrically connected to the temperature detecting chip, and another end of the cable comprises a connector to connect to a slot arranged on the hard disk drive backplane.

3. The hard disk drive module of claim 1 , wherein the temperature detecting chip is a temperature sensor having a system management bus (SMbus) interface.

4. The hard disk drive module of claim 3 , wherein the cable is a SMbus.

5. The hard disk drive module of claim 1 , wherein the temperature chip comprises a data pin and a clock pin, the data pin and the clock pin are electrically connected to the connector via the cable.

6. The hard disk drive module of claim 5 , wherein the data pin and the clock pin are electrically connected to the power source via a fourth resistor and a fifth resistor, respectively.

7. The hard disk drive module of claim 1 , wherein the bracket is U-shaped, the bracket comprises a main body and two arms extending outwardly from opposite ends of the main body, the two arms are substantially parallel to each other and substantially perpendicular to the main body, and the hard disk drive is sandwiched between the two arms.

8. The hard disk drive module of claim 7 , wherein the bracket further comprises a plurality of hooks protruding from an inner surface of each arm to secure the cable on the bracket.

9. A hard disk drive module, comprising:

a hard disk drive;

a bracket supporting the hard disk drive;

a hard disk drive backplane electrically connected to the hard disk drive; and

a temperature detecting circuit comprising a temperature detecting chip arranged on the bracket and a cable, wherein one end of the cable is electrically connected to the temperature detecting chip, and the other end of the cable is electrically connected to the hard disk drive backplane; and

wherein the temperature detecting chip comprises three address pins, one of the three address pin is grounded via a first resistor, and the other two of the three address pins are electrically connected to a power source via a second resistor and a third resistor, respectively.

10. The hard disk drive module of claim 9 , wherein the other end of the cable comprises a connector to connect to a slot arranged on the hard disk drive backplane.

11. The hard disk drive module of claim 9 , wherein the temperature detecting chip is a temperature sensor having a system management bus (SMbus) interface.

12. The hard disk drive module of claim 11 , wherein the cable is a SMbus.

13. The hard disk drive module of claim 9 , wherein the temperature chip comprises a data pin and a clock pin, and the data pin and the clock pin are electrically connected to the connector via the cable.

14. The hard disk drive module of claim 13 , wherein the data pin and the clock pin are electrically connected to the power source via a fourth resistor and a fifth resistor, respectively.

15. The hard disk drive module of claim 9 , wherein the bracket is U-shaped, the bracket comprises a main body and two arms extending outwardly from opposite ends of the main body, the two arms are substantially parallel to each other and substantially perpendicular to the main body, and the hard disk drive is sandwiched between the two arms.

16. The hard disk drive module of claim 15 , wherein the bracket further comprises a plurality of hooks protruding from an inner surface of each arm to secure the cable on the bracket.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2019
From: ZHONGSHAN INNOCLOUD INTELLECTUAL PROPERTY SERVICES CO.,LTD.
To: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
Reel/Frame 050709/0949 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2015
From: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
To: ZHONGSHAN INNOCLOUD INTELLECTUAL PROPERTY SERVICES CO.,LTD.
Reel/Frame 035089/0435 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2015
From: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
To: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
Reel/Frame 035070/0729 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2014
From: WU, KANG; TIAN, BO
To: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 033451/0649 →
Priority Claims (1)
CN 2012 1 05617742 · Dec 22, 2012 · national
Continuity (1)
Related Publication 20140177097A1 · Jun 26, 2014