Vertical structure LEDs

1. A light-emitting device, comprising:

a conductive support structure;

a semiconductor structure disposed on the conductive support structure, wherein the semiconductor structure comprises a first-type semiconductor layer, an active layer, and a second-type semiconductor layer, wherein the semiconductor structure having a first semiconductor surface, a side semiconductor surface, and a second semiconductor surface, wherein the first semiconductor surface, relative to the second semiconductor surface, is proximate to the conductive support structure, and wherein the second semiconductor surface is opposite to the first semiconductor surface;

a first electrode electrically connected to the first-type semiconductor layer;

a second electrode electrically connected to the second-type semiconductor layer, wherein the second electrode has a first electrode surface, a side electrode surface, and a second electrode surface, wherein the first electrode surface, relative to the second electrode surface, is proximate to the semiconductor structure; and wherein the second electrode surface is opposite to the first electrode surface; and

a passivation layer disposed on the side semiconductor surface and the second semiconductor surface, wherein the passivation layer comprises a first portion contacting the first-type semiconductor layer, a second portion contacting the active layer, a third portion contacting the second-type semiconductor layer, a fourth portion contacting the side electrode surface, and a fifth portion contacting the second electrode surface.

2. The device according to claim 1 , wherein the third portion of the passivation layer is greater than the first portion of the passivation layer.

3. The device according to claim 1 , wherein the third portion of the passivation layer is greater than the fourth portion of the passivation layer.

4. The device according to claim 1 , wherein the third portion of the passivation layer is greater than the fifth portion of the passivation layer.

5. The device according to claim 1 , wherein the fourth portion of the passivation layer is greater than the fifth portion of the passivation layer.

6. The device according to claim 1 , wherein the fifth portion is patterned to form an open space to expose the second surface of the second electrode, and further comprising a metal pad disposed on the open space.

7. A light-emitting device, comprising:

a support structure;

a semiconductor structure disposed on the support structure, wherein the semiconductor structure comprises a first-type semiconductor layer, an active layer, and a second-type semiconductor layer, wherein the semiconductor structure having a first semiconductor surface, a side semiconductor surface, and a second semiconductor surface, wherein the first semiconductor surface, relative to the second semiconductor surface, is proximate to the support structure, and wherein the second semiconductor surface is opposite to the first semiconductor surface;

a first electrode electrically connected to the first-type semiconductor layer;

a second electrode electrically connected to the second-type semiconductor layer, wherein the second electrode has a first electrode surface, a side electrode surface, and a second electrode surface, wherein the first electrode surface, relative to the second electrode surface, is proximate to the semiconductor structure, and wherein the second electrode surface is opposite to the first electrode surface; and

a passivation layer disposed on the side semiconductor surface and the second semiconductor surface, wherein the passivation layer comprises a portion contacting the second electrode surface, and

a metal pad disposed on the second electrode, wherein a part of the metal pad is disposed on the portion of the passivation layer.

8. The device according to claim 7 , wherein the part of the metal pad contacts the portion of the passivation layer.

9. The device according to claim 7 , wherein the portion of the passivation layer is patterned to form an open space to expose the second electrode surface.

10. The device according to claim 9 , wherein the metal pad is disposed on the open space,

wherein the portion of the passivation layer has a first surface, a side surface, and a second surface,

wherein the first surface, relative to the second surface, is proximate to the second electrode, and

wherein the second surface is opposite to the first surface.

11. The device according to claim 7 , wherein a part of the metal pad is disposed on the side surface of the portion of the passivation layer.

12. The device according to claim 11 , wherein the part of the metal pad contacts the side surface of the portion of the passivation layer.

13. A light-emitting device, comprising:

a conductive support structure comprising Cu;

a GaN-based semiconductor structure disposed on the conductive support structure, wherein the GaN-based semiconductor structure comprises a p-type GaN-based layer, a GaN-based active layer, and an n-type GaN-based layer, wherein the GaN-based semiconductor structure has a first semiconductor surface, a side semiconductor surface, and a second semiconductor surface, wherein the first semiconductor surface, relative to the second semiconductor surface, is proximate to the conductive support structure, wherein the second semiconductor surface is opposite to the first semiconductor surface, and wherein a thickness of the GaN-based semiconductor structure is less than 5 microns;

a p-type electrode electrically connected to the p-type GaN-based layer;

an n-type electrode electrically connected to the n-type GaN-based layer, wherein the n-type electrode has a first electrode surface, a side electrode surface, and a second electrode surface, wherein the first electrode surface, relative to the second electrode surface, is proximate to the semiconductor structure; and wherein the second electrode surface is opposite to the first electrode surface; and

a passivation layer disposed on the side semiconductor surface and the second semiconductor surface, wherein the passivation layer comprises a first portion contacting the p-type GaN-based layer, a second portion contacting the GaN-based active layer, a third portion contacting the n-type GaN-based layer, a fourth portion contacting the side electrode surface, and a fifth portion contacting the second electrode surface.

14. The device according to claim 13 , wherein the third portion of the passivation layer is greater than the first portion of the passivation layer.

15. The device according to claim 13 , wherein the third portion of the passivation layer is greater than the fourth portion of the passivation layer.

16. The device according to claim 13 , wherein the third portion of the passivation layer is greater than the fifth portion of the passivation layer.

17. The device according to claim 13 , wherein the fourth portion of the passivation layer is greater than the fifth portion of the passivation layer.

18. The device according to claim 13 , wherein the fifth portion of the passivation layer is patterned to form an open space to expose the second surface of the second electrode, and further comprises a metal pad disposed on the open space.

19. The device according to claim 18 , wherein the third portion of the passivation layer is greater than the first electrode surface.

20. The device according to claim 6 , wherein the third portion of the passivation layer is greater than the first electrode surface.