IP Library Granted Patent US 9,332,857
Granted Patent B2
US 9,332,857 · App. 14/102,633 · Granted May 10, 2016

Mattress assembly

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Quick Facts
Patent No.
US 9,332,857
App. No.
14/102,633
Granted
May 10, 2016
Kind
B2
Abstract

A mattress assembly includes a first layer of viscoelastic foam defining an upper surface, and a second layer of non-viscoelastic foam supporting the first layer. The mattress assembly also includes a plurality of spring elements positioned beneath the upper surface for enhancing a firmness of the combined first and second layers. Each of the spring elements includes a first spring having a first spring rate and a second spring having a second spring rate different than the first spring rate.

Claims (20)

1. A mattress assembly comprising:

a first layer of viscoelastic foam defining an upper surface;

a second layer of non-viscoelastic foam supporting the first layer; and

a plurality of spring elements positioned beneath the upper surface for enhancing a firmness of the combined first and second layers, each of the spring elements including a first spring having a first spring rate and a second spring beneath the first spring and having a second spring rate greater than the first spring rate and a third spring beneath the second spring and having a third spring rate greater than both the first and second spring rates, wherein the first spring is supported upon the second spring and the second spring is supported upon the third spring, the spring elements being positioned in series within discrete cavities within the second layer of non-viscoelastic foam.

2. The mattress assembly of claim 1 , wherein the viscoelastic foam includes a hardness of at least about 20 N and no greater than about 80 N.

3. The mattress assembly of claim 1 , wherein the viscoelastic foam includes a density of no less than about 30 kg/m3 and no greater than about 150 kg/m3.

4. The mattress assembly of claim 1 , wherein the second layer of non-viscoelastic foam is one of a latex foam and a high-resilience polyurethane foam.

5. The mattress assembly of claim 4 , wherein the latex foam includes a hardness of at least about 30 N and no greater than about 130 N, and wherein the high-resilience polyurethane foam includes a hardness of at least about 80 N and no greater than about 200 N.

6. The mattress assembly of claim 4 , wherein the latex foam includes a density of no less than about 40 kg/m3 and no greater than about 100 kg/m3, and wherein the high-resilience polyurethane foam includes a density of no less than about 10 kg/m3 and no greater than about 80 kg/m3.

7. The mattress assembly of claim 1 , wherein the cavities are formed by a drilling process.

8. The mattress assembly of claim 1 , wherein the cavities are formed by a cutting process.

9. The mattress assembly of claim 1 , wherein the first and second springs are made of a polymeric material.

10. The mattress assembly of claim 9 , wherein the first and second springs are made of a thermoplastic material.

11. The mattress assembly of claim 1 , wherein the spring elements are aligned with a thickness of the mattress assembly.

12. The mattress assembly of claim 1 , wherein the first and second springs are configured as coil springs.

13. The mattress assembly of claim 1 , wherein the spring elements are arranged in an array having a plurality of rows and a plurality of columns.

14. The mattress assembly of claim 1 , wherein the first spring rate is between about 150 lbs/in and about 200 lb/in.

15. The mattress assembly of claim 1 , wherein the second spring rate is between about 200 lbs/in and about 250 lbs/in.

16. The mattress assembly of claim 1 , wherein the third spring rate is between about 250 lbs/in and about 300 lbs/in.

17. The mattress assembly of claim 1 , wherein at least one of the first spring and the second spring is thermally conductive to dissipate heat away from the first layer.

Assignments (7)
SECURITY INTEREST Recorded Oct 25, 2023
From: TEMPUR WORLD, LLC
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 065349/0881 →
RELEASE OF SECURITY INTEREST Recorded Oct 25, 2023
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TEMPUR-PEDIC MANAGEMENT, LLC; SEALY TECHNOLOGY LLC; TEMPUR WORLD, LLC
Reel/Frame 065344/0650 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2019
From: TEMPUR-PEDIC MANAGEMENT, LLC
To: TEMPUR WORLD, LLC
Reel/Frame 048019/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2018
From: ALZOUBI, MOHAMED F.; ARENDOSKI, CHRISTOPHER; KILGORE, TYLER W.
To: TEMPUR-PEDIC MANAGEMENT, LLC
Reel/Frame 046130/0874 →
PATENT SECURITY AGREEMENT Recorded Apr 13, 2016
From: TEMPUR-PEDIC MANAGEMENT, LLC; SEALY TECHNOLOGY LLC; TEMPUR WORLD, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 038426/0257 →
RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Apr 11, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: TEMPUR-PEDIC MANAGEMENT, LLC; SEALY TECHNOLOGY LLC
Reel/Frame 038403/0221 →
PATENT SECURITY AGREEMENT (SUPPLEMENT) Recorded Feb 27, 2014
From: TEMPUR-PEDIC MANAGEMENT, LLC; SEALY TECHNOLOGY LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 032366/0105 →