IP Library Granted Patent US 9,165,237
Granted Patent B2
US 9,165,237 · App. 14/103,011 · Granted Oct 20, 2015

SIM card adapter

Inventors: Michele Scarlatella (Naples, IT); Mariarosaria Migliaccio (Caserta, IT); Paolo Frallicciardi (Salerno, IT); Attilio Derosa (Avellino, IT)
Assignees: STMICROELECTRONICS S.R.L.; STMICROELECTRONICS INTERNATIONAL N.V.
G06K19/07739Y10T29/49117
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Quick Facts
Patent No.
US 9,165,237
App. No.
14/103,011
Granted
Oct 20, 2015
Kind
B2
Abstract

A SIM card adapter assembly is to adapt a SIM card to a SIM slot. The adapter assembly includes a SIM card plastic support including a first portion of a predetermined thickness. The SIM card is removably attached and a second portion has an increased thickness wherein at least one adapter is removably attached.

Claims (35)

1. A subscriber identification module (SIM) card adapter assembly comprising:

a SIM card support comprising a first portion having a first thickness, and a second portion having a second thickness greater than the first thickness;

a SIM card removably attached to the first portion, with the SIM card configured to be received by a SIM slot having a first size; and

at least one SIM card adapter removably attached to the second portion, with the at least one SIM card adapter configured to be received by a SIM slot having a second size different from the first size, and with the at least one SIM card adapter also configured to receive the SIM card so as to adapt the SIM card to the second size SIM slot.

2. The SIM card adapter assembly according to claim 1 , wherein the SIM card has a same thickness as the first thickness.

3. The SIM card adapter assembly according to claim 1 , wherein the SIM card comprises a 4FF SIM card configured to be inserted in a 4FF SIM slot without an adapter; and wherein the at least one adapter comprises at least one of a 2FF adapter and a 3FF adapter.

4. The SIM card adapter assembly according to claim 1 , wherein the at least one SIM card adapter has a same thickness as the second thickness.

5. The SIM card adapter assembly according to claim 1 , wherein the second thickness is the same as a thickness of a 2FF SIM card or a 3FF SIM card.

6. The SIM card adapter assembly according to claim 1 , wherein the at least one adapter comprises a first adapter and a second adapter nested within the first adapter.

7. The SIM card adapter assembly according to claim 1 , wherein the at least one adapter comprises a bottom support, a plastic frame around the bottom surface defining an opening receiving the SIM card.

8. The SIM card adapter assembly according to claim 7 , wherein the bottom support is integrally formed with a bottom of the SIM card support.

9. The SIM card adapter assembly according to claim 1 , wherein the SIM card support has a generally rectangular shape, and comprises plastic.

10. The SIM card adapter assembly according to claim 1 , wherein the SIM card support has a flat base and a counter posed stepwise surface including a first step between an upper surface of the second portion and an upper surface of the first portion.

11. The SIM card adapter assembly according to claim 10 , wherein the SIM card is substantially coplanar with the upper surface of the first portion.

12. The SIM card adapter assembly according to claim 10 , wherein the first portion comprises a second step and a third step that delimit, respectively, a first recess and a second recess adapted to receive the SIM card; and wherein the first and second recesses are filled by the SIM card.

13. The SIM card adapter assembly according to claim 12 , the first recess has a base that supports a contact area of the SIM card, and the second recess receives an encapsulation layer of the SIM card.

14. A subscriber identification module (SIM) card adapter assembly comprising:

a SIM card support comprising a first portion having a first thickness, and a second portion having a second thickness greater than the first thickness, the first portion to removably receive a SIM card that is configured to be received by a SIM slot having a first size; and

at least one SIM card adapter removably attached to the second portion, with the at least one SIM card adapter configured to be received by a SIM slot having a second size different from the first size, and with the at least one SIM card adapter also configured to receive the SIM card so as to adapt the SIM card to the second size SIM slot.

15. The SIM card adapter assembly according to claim 14 , wherein the first thickness is the same as the SIM card.

16. The SIM card adapter assembly according to claim 14 , wherein the at least one adapter comprises at least one of a 2FF adapter and a 3FF adapter.

17. The SIM card adapter assembly according to claim 14 , wherein the at least one SIM card adapter has a same thickness as the second thickness.

18. The SIM card adapter assembly according to claim 14 , wherein the second thickness is the same as a thickness of a 2FF SIM card or a 3FF SIM card.

19. The SIM card adapter assembly according to claim 14 , wherein the at least one adapter comprises a first adapter and a second adapter nested within the first adapter.

20. The SIM card adapter assembly according to claim 14 , wherein the SIM card support has a generally rectangular shape, and comprises plastic.

21. A method for making a subscriber identification module (SIM) card adapter assembly comprising:

forming a SIM card support comprising a first portion having a first thickness, and a second portion having a second thickness greater than the first thickness;

removably attaching a SIM card to the first portion, with the SIM card configured to be received by a SIM slot having a first size; and

removably attaching at least one SIM card adapter to the second portion, with the at least one SIM card adapter configured to be received by a SIM slot having a second size different from the first size, and with the at least one SIM card adapter also configured to receive the SIM card so as to adapt the SIM card to the second size SIM slot.

22. The method according to claim 21 , wherein the SIM card has a same thickness as the first thickness.

23. The method according to claim 21 , wherein the SIM card comprises a 4FF SIM card configured to be inserted in a 4FF SIM slot without an adapter; and wherein the at least one adapter comprises at least one of a 2FF adapter and a 3FF adapter.

24. The method according to claim 21 , wherein the at least one SIM card adapter has a same thickness as the second thickness.

25. The method according to claim 21 , wherein the second thickness is the same as a thickness of a 2FF SIM card or a 3FF SIM card.

26. The method according to claim 21 , wherein the at least one adapter comprises a first adapter and a second adapter nested within the first adapter.

27. The method according to claim 21 , wherein the SIM card support has a generally rectangular shape, and comprises plastic.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 060301/0355 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2014
From: SCARLATELLA, MICHELE; MIGLIACCIO, MARIAROSARIA; FRALLICCIARDI, PAOLO; DEROSA, ATTILIO
To: STMICROELECTRONICS S.R.L.; STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 031887/0209 →
Priority Claims (1)
IT MI2012A02184 · Dec 19, 2012 · national
Continuity (1)
Related Publication 20140166763A1 · Jun 19, 2014