IP Library Granted Patent US 9,315,627
Granted Patent B2
US 9,315,627 · App. 14/103,875 · Granted Apr 19, 2016

Polyamide ester resin, method of preparing the same, and molded article including the same

Inventors: Eun Ju Lee (Uiwang-si, KR); So Young Kwon (Uiwang-si, KR); Joon Sung Kim (Uiwang-si, KR); Sang Kyun Im (Uiwang-si, KR); Sung Chul Choi (Uiwang-si, KR); Ki Yon Lee (Uiwang-si, KR); Suk Min Jun (Uiwang-si, KR)
Assignee: Cheil Industries Inc.
C08G69/44C08L77/12H01L33/60
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Quick Facts
Patent No.
US 9,315,627
App. No.
14/103,875
Granted
Apr 19, 2016
Kind
B2
Abstract

A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C. The polyamide ester resin can exhibit excellent heat resistance, discoloration resistance, and moldability.

Claims (20)

1. A polyamide ester resin comprising a polymer of:

a dicarboxylic acid comprising an aromatic dicarboxylic acid;

a diamine comprising a linear aliphatic diamine; and

a linear aliphatic diol,

wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C.

2. The polyamide ester resin according to claim 1 , wherein the dicarboxylic acid further comprises C 8 to C 20 alicyclic dicarboxylic acid.

3. The polyamide ester resin according to claim 1 , wherein the diamine comprises at least one of C 4 to C 20 linear aliphatic diamines.

4. The polyamide ester resin according to claim 1 , wherein the linear aliphatic diol comprises at least one of C 2 to C 20 linear aliphatic diols.

5. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a glass transition temperature (Tg) from about 80° C. to about 120° C.

6. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has an intrinsic viscosity from about 0.5 dL/g to about 1.0 dL/g.

7. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a color change (ΔE) of from about 5 to about 10 as calculated by Equation 1:

Color change (Δ E )=√{square root over ((Δ L *) 2 +(Δ a *) 2 +(Δ b *) 2 )}{square root over ((Δ L *) 2 +(Δ a *) 2 +(Δ b *) 2 )}{square root over ((Δ L *) 2 +(Δ a *) 2 +(Δ b *) 2 )}  (1)

wherein ΔL* is a difference between L* values before and after scorch testing, Δa* is a difference between a* values before and after scorch testing, and Δb* is a difference between b* values before and after scorch testing, in which about 1 g to about 3 g of the polyamide ester resin is left in a convection oven at about 200° C. for about 1 hour.

8. The polyamide ester resin according to claim 1 , wherein the polyamide ester resin has a terminal group encapsulated with an end capping agent comprising an aliphatic carboxylic acid, an aromatic carboxylic acid, or a mixture thereof.

9. The polyamide ester resin according to claim 8 , wherein the end capping agent comprises acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, isobutyric acid, benzoic acid, toluic acid, α-naphthalene carboxylic acid, β-naphthalene carboxylic acid, methylnaphthalene carboxylic acid, or a mixture thereof.

10. A method of preparing a polyamide ester resin, comprising: polymerizing a dicarboxylic acid comprising an aromatic dicarboxylic acid, a diamine comprising a linear aliphatic diamine and a linear aliphatic diol,

wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and

wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290°.

11. A molded article comprising the polyamide ester resin according to claim 1 .

12. The molded article according to claim 11 , wherein the molded article is an LED reflector.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2013
From: LEE, EUN JU; KWON, SO YOUNG; KIM, JOON SUNG; IM, SANG KYUN; CHOI, SUNG CHUL; LEE, KI YON; JUN, SUK MIN
To: CHEIL INDUSTRIES INC.
Reel/Frame 031766/0440 →
Priority Claims (1)
KR 10-2013-0062737 · May 31, 2013 · national
Continuity (1)
Related Publication 20140357832A1 · Dec 4, 2014