Direct integration of feedthrough to implantable medical device housing by sintering

1. A method of attaching a feedthrough to a titanium housing of an implantable medical device, the method comprising:

applying a sinter paste onto a surface of the housing about a perimeter of an opening through the housing, the sinter paste including a biocompatible bonding material;

placing an insulator of the feedthrough onto the sinter paste so as to cover the opening;

heating the sinter paste to a temperature less than a beta-transus temperature the titanium of the housing and to a temperature less than a melting point of the biocompatible bonding material for a desired duration to form, from the sinter paste, a sinter joint which bonds the feedthrough directly to the housing, without using a ferrule and without brazing or welding, thereby hermetically sealing the opening, wherein the heating is carried out in an oven having a non-oxygen and non-vacuum environment; and

metallizing portions of surfaces of the insulator contacting the sinter paste and resulting sinter joint.

2. The method of claim 1 , including forming the sinter paste by mixing the biocompatible bonding material in a powdered form with a binder material.

3. The method of claim 2 , wherein the powdered biocompatible bonding material has particles with a maximum dimension of less than 20 μm.

4. The method of claim 3 , wherein the particles are spherical in shape with a diameter less than 20 μm.

5. The method of claim 1 , wherein the biocompatible bonding material comprises gold.

6. The method of claim 1 , wherein the biocompatible bonding material comprises one of gold, platinum, palladium, and any alloy combination thereof.

7. The method of claim 1 , further including applying a force to the feedthrough during the heating to push the insulator toward the housing so as to compress the sinter paste as the sinter paste loses volume due to binders within the sinter paste burning off during the heating.

8. The method of claim 7 , further including providing a counter force to support the housing to prevent deflection of the housing.

9. A method of attaching a feedthrough device to hermetically seal an opening in a titanium housing of an implantable medical device, the method comprising:

applying a sinter paste about a perimeter of the opening, the sinter paste including a biocompatible bonding material;

positioning the feedthrough on the sinter paste to cover the opening, the feedthrough having a width greater than a width of the opening;

heating the sinter paste to a temperature less than a β-transus temperature of the titanium of the housing and less than a melting point of the biocompatible bonding material to form a sinter joint from the sinter paste that bonds the feedthrough directly to the housing, without using a ferrule and without brazing or welding, thereby hermetically sealing the opening, wherein the heating is carried out in an oven having a non-oxygen and non-vacuum environment; and

metallizing portions of surfaces of the insulator contacting the sinter paste and resulting sinter joint.

10. The method of claim 9 , including forming the sinter paste by mixing the biocompatible bonding material in a powder form with a binding material.

11. The method of claim 9 , further including applying a force to the feedthrough during the heating to push the insulator toward the housing so as to compress the sinter paste as the sinter paste loses volume due to binders within the sinter paste burning off during the heating, and providing a counter force to support the housing to prevent deflection of the housing.

12. The method of claim 9 , wherein heating the sinter paste forms sinter joint between the insulator and the housing along a perimeter of the housing opening having a width that is at least one quarter a width of the insulator at its widest point.

13. The method of claim 12 , wherein a plane normal to the opening passes through the housing, the sinter joint, and the insulator.

14. The method of claim 12 , wherein the sinter joint has a thickness in a direction perpendicular to the housing in a range from 25 to 200 μm.

15. The method of claim 9 , further comprising forming the housing to include a flange which forms a recess about the opening, the opening being disposed at a bottom of the recess, and the insulator being positioned at least partially within the recess and over the opening.