Semiconductor device and method of manufacturing the same
Characteristics of a semiconductor device are improved. A semiconductor device has a laminated insulating film formed above a lower-layer inductor. This laminated insulating film includes a first polyimide film, and a second polyimide film formed on the first polyimide film and having a second step between the first polyimide film and the second polyimide film. An upper-layer inductor is formed on the laminated insulating film. Since such a laminated structure of the first and second polyimide films is adopted, the film thickness of the insulating film between the lower-layer and upper-layer inductors can be increased, so that withstand voltage can be improved. Further, the occurrence of a depression or peeling-off due to defective exposure can be reduced, and step disconnection of a Cu (copper) seed layer or a plating defect due to the step disconnection can also be reduced.
1. A semiconductor device comprising:
a semiconductor substrate having a main surface;
a first insulating film formed on the main surface;
a first coil formed on the first insulating film;
a second insulating film formed on the first coil and having a first main surface and first side surfaces continuous with the first main surface;
a third insulating film formed on the first main surface of the second insulating film and having a second main surface and second side surfaces continuous with the second main surface; and
a second coil formed on the second main surface of the third insulating film,
wherein the second insulating film and the third insulating film are formed as a laminated insulating film together, having a first step formed by the first main surface and the second main surface via the second side surfaces.
2. The semiconductor device according to claim 1 , wherein the second insulating film and the third insulating film are organic insulating films.
3. The semiconductor device according to claim 1 , further comprising:
a fourth insulating film formed between the main surface and the first insulating film; and
a first wiring formed between the first insulating film and the fourth insulating film and overlapping with the first coil in a plan view,
wherein, in a cross-sectional view, the first coil and the first wiring are connected via a plurality of connecting portions penetrating the first insulating film.
4. The semiconductor device according to claim 3 , further comprising
a first region and a second region,
wherein, the second region includes:
the first coil;
the laminated insulating film; and
the second coil, and
the first region includes:
a second wiring formed on the first insulating film;
a first pad from which the second wiring is exposed through an opening portion of a fifth insulating film that is on the second wiring; and
a third wiring formed of a first conductive film that is formed so as to extend on and along the first pad and the fifth insulating film and a second conductive film that is formed on the first conductive film.
5. The semiconductor device according to claim 4 , further comprising
a plurality of active elements formed on the main surface,
wherein the first region and the plurality of active elements overlap with each other in a plan view.
6. The semiconductor device according to claim 4 , further comprising:
a sixth-a insulating film formed on the second coil;
a sixth-b insulating film formed on the third wiring; and
a trench having the fourth insulating film at its bottom portion, the trench being formed at a border between the sixth-a insulating film in the second region and the sixth-b insulating film in the first region.
7. The semiconductor device according to claim 6 ,
wherein the sixth-a insulating film is formed on the second main surface of the third insulating film and having a third main surface and third side surfaces continuous with the third main surface, and
the third insulating film and the sixth-a insulating film are formed as a laminated insulating film together, having a second step formed by the second main surface and the third main surface via the third side surfaces.
8. The semiconductor device according to claim 7 ,
wherein the second insulating film, the third insulating film, and a sixth insulating film composed of the sixth-a insulating film and the sixth-b insulating film are organic insulating films.
9. The semiconductor device according to claim 8 ,
wherein the sixth insulating film has a negative-type photosensitivity.
10. The semiconductor device according to claim 8 ,
wherein the semiconductor substrate is an SOI (Silicon on Insulator) substrate including a supporting substrate, an insulating layer formed on the supporting substrate, and a semiconductor film formed on the insulating layer.
11. The semiconductor device according to claim 4 , further comprising
a plurality of the second wirings,
wherein the third wiring connects two or more of the first pads that are exposed regions of the plurality of second wirings.
12. A method of manufacturing a semiconductor device comprising the steps of:
(a) forming a first coil on a first insulating film above a semiconductor substrate;
(b) forming a laminated insulating film above the first coil, including the steps of:
(b1) forming a second insulating film above the first insulating film; and
(b2) forming a third insulating film on the second insulating film, the third insulating film being formed so as to have a step between the second insulating film and the third insulating film; and
(c) forming a second coil on the laminated insulating film.
13. The method of manufacturing a semiconductor device according to claim 12 ,
wherein the second insulating film and the third insulating film are photosensitive organic insulating films.
14. The method of manufacturing a semiconductor device according to claim 12 ,
wherein the step (c) includes the steps of:
(c1) forming a power feeding layer on the laminated insulating film;
(c2) forming a photoresist film on the power feeding layer;
(c3) forming an opening portion in a planned forming region of the second coil of the photoresist film; and
(c4) causing a plating film to grow from the power feeding layer in the opening portion.
15. The method of manufacturing a semiconductor device according to claim 12 , further comprising a step of
(d) forming a fourth insulating film on the second coil.
16. A method of manufacturing a semiconductor device comprising the steps of:
(a) forming an active element in a first region of a semiconductor substrate;
(b) forming a wiring in the first region of the semiconductor substrate and forming a first coil in a second region of the semiconductor substrate;
(c) forming a first insulating film on the wiring and the first coil;
(d) forming a laminated insulating film on the first insulating film on the first coil of the second region of the semiconductor substrate, the step (d) including the steps of:
(d1) forming a second insulating film on the first insulating film; and
(d2) forming a third insulating film on the second insulating film, the third insulating film being formed so as to have a step between the second insulating film and the third insulating film; and
(e) forming a second coil on the laminated insulating film and forming a rewiring extended on the first insulating film from a first pad region opened in the first insulating film on the wiring.
17. The method of manufacturing a semiconductor device according to claim 16 ,
wherein the step (e) includes the steps of:
(e1) forming a power feeding layer on the first insulating film and the laminated insulating film;
(e2) forming a photoresist film on the power feeding layer;
(e3) forming a first opening portion in a planned forming region of the second coil of the photoresist film;
(e4) forming a second opening portion in a planned forming region of the rewiring of the photoresist film; and
(e5) causing a plating film to grow from the power feeding layer in the first opening portion and the second opening portion.
18. The method of manufacturing a semiconductor device according to claim 17 , further comprising the step of:
(f) forming a fourth insulating film on the second coil and the rewiring.
19. The method of manufacturing a semiconductor device according to claim 18 , further comprising the step of:
(g) removing the fourth insulating film to form a second pad region on the rewiring.
20. The method of manufacturing a semiconductor device according to claim 19 ,
wherein, at the step (g), the fourth insulating film in a border between the first region and the second region is removed.