IP Library Granted Patent US 9,789,587
Granted Patent B1
US 9,789,587 · App. 14/108,324 · Granted Oct 17, 2017

Leaching assemblies, systems, and methods for processing superabrasive elements

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Quick Facts
Patent No.
US 9,789,587
App. No.
14/108,324
Granted
Oct 17, 2017
Kind
B1
Abstract

A polycrystalline diamond element leaching assembly includes a polycrystalline diamond element, a protective leaching cup surrounding at least a portion of the polycrystalline diamond element, and a protective layer positioned between the polycrystalline diamond element and the protective leaching cup. A method of processing a polycrystalline diamond element includes covering a selected portion of a polycrystalline diamond element with a curable resin layer, curing the curable resin layer to form a protective layer, and exposing at least a portion of the polycrystalline diamond element to a leaching agent. Another method of processing a polycrystalline diamond element includes depositing a curable resin within a protective leaching cup and positioning a polycrystalline diamond element within the protective leaching cup such that the curable resin is displaced so as to surround at least a portion of the polycrystalline diamond element.

Claims (35)

1. A method of processing a polycrystalline diamond element, the method comprising:

depositing a curable material within a protective leaching cup, the protective leaching cup including a rear wall and a side wall, the side wall comprising:

a seal region having a first inner diameter;

an encapsulating region extending between the seal region and the rear wall, the encapsulating region having a second inner diameter that is greater than the first inner diameter;

positioning a polycrystalline diamond element, which comprises a polycrystalline diamond table bonded to a substrate, within the protective leaching cup such that:

the curable material is disposed within the encapsulating region so as to surround at least a portion of the substrate;

the curable material does not contact the polycrystalline diamond table;

the curable material does not occupy a region of volume defined between the substrate and the protective leaching cup;

curing the curable material to form a protective layer on at least the portion of the substrate;

exposing at least a portion of the polycrystalline diamond element to a leaching agent such that the leaching agent contacts an exposed surface region of the polycrystalline diamond table.

2. The method of claim 1 , wherein:

the protective leaching cup comprises an opening defined in a portion of the protective leaching cup opposite the rear wall;

the side wall extends between the opening and the rear wall, the side wall and the rear wall defining a cavity within the protective leaching cup.

3. The method of claim 2 , wherein depositing the curable material within the protective leaching cup comprises depositing the curable material adjacent the rear wall of the protective leaching cup.

4. The method of claim 2 , wherein the curable material does not occupy a region of volume defined between the substrate and the rear wall of the protective leaching cup.

5. The method of claim 1 , wherein:

the polycrystalline diamond element comprises:

a cutting face;

a rear face opposite the cutting face;

a side surface extending between the cutting face and the rear face;

positioning the polycrystalline diamond element within the protective leaching cup comprises:

forcing the substrate against the curable material such that the curable material is displaced within the encapsulating region of the protective leaching cup.

6. The method of claim 1 , wherein the seal region of the protective leaching cup tightly surrounds at least a portion of the side surface of the polycrystalline diamond table so as to form a seal between the seal region and the side surface.

7. The method of claim 1 , wherein curing the curable material comprises exposing the curable material to light.

8. The method of claim 7 , wherein:

the protective leaching cup comprises a light-transmissive material; and

exposing the curable material to the light further comprises transmitting the light through at least a portion of the side wall of the protective leaching cup.

9. The method of claim 7 , wherein the light comprises near-ultraviolet light.

10. The method of claim 1 , wherein curing the curable material comprises heating the curable material to at least a threshold temperature.

11. The method of claim 1 , wherein exposing at least the portion of the polycrystalline diamond element to the leaching agent comprises submerging at least the portion of the polycrystalline diamond table and at least a portion of the protective leaching cup in the leaching agent.

12. The method of claim 1 , wherein the seal region contacts a portion of the polycrystalline diamond table.

13. The method of claim 1 , wherein positioning the polycrystalline diamond element within the protective leaching cup further comprises forcing at least a portion of the seal region of the side wall outward and away from the polycrystalline diamond element.

14. The method of claim 13 , wherein positioning the polycrystalline diamond element within the protective leaching cup further comprises defining a gap between at least the portion of the seal region of the side wall and the polycrystalline diamond element.

15. The method of claim 1 , wherein the substrate comprises a chamfer.

16. The method of claim 1 , wherein the protective layer does not occupy the region of volume defined between the substrate and the protective leaching cup.

Assignments (6)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2013
From: MORTENSEN, DANIEL CALL; OLSEN, TREVOR ALLEN; SCHAEFER, HEATHER MARIE; WILDING, DANIEL PRESTON
To: US SYNTHETIC CORPORATION
Reel/Frame 031819/0217 →