Noble metal surface treatment to improve adhesion in bio-compatible devices
View Patent ↗A method involving forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer, wherein the first bio-compatible layer defines a first side of a bio-compatible device; forming a conductive pattern on the first bio-compatible layer, the conductive pattern comprising a metal; mounting an electronic component to the conductive pattern; forming a self-assembled monolayer (SAM) on the conductive pattern by contacting the conductive pattern with a functionalized sulfur compound or a functionalized selenium compound; forming an adhesion layer on the SAM by contacting the SAM with an adhesion promoter; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern having the adhesion layer, wherein the second bio-compatible layer defines a second side of the bio-compatible device; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.
1. A bio-compatible device comprising:
a sacrificial layer on a working substrate;
a first bio-compatible layer on the sacrificial layer, wherein the first bio-compatible layer adheres to the sacrificial layer, and wherein the first bio-compatible layer defines a first side of the bio-compatible device;
a conductive pattern on the first bio-compatible layer, the conductive pattern having a self-assembled monolayer (SAM) thereon;
an electronic component mounted to the conductive pattern; and
a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern, wherein the second bio-compatible layer defines a second side of the bio-compatible device, wherein the sacrificial layer is configured to be removed to release the bio-compatible device from the working substrate.
2. The device according to claim 1 , wherein the SAM is formed by contacting the conductive pattern with a functionalized sulfur compound or a functionalized selenium compound.
3. The device according to claim 1 , further comprising an adhesion layer between the SAM and the second-biocompatible layer.
4. The device according to claim 3 , wherein the adhesion layer is formed by contacting the SAM with an adhesion promoter.
5. The device according to claim 1 , wherein the second biocompatible polymer is a polyp-xylylene) polymer.
6. The device according to claim 1 , wherein the biocompatible polymer is Parylene C.