Adding test access to a back-drilled VIA
View Patent ↗Embodiments of the invention relates to adding test access to a back-drilled vertical access interconnect (VIA) of a printed circuit board (PCB). A VIA is either formed or provided as an opening through layers of the PCB. The VIA is countersunk from one of the two openings to the PCB prior to plating to form a surface that can be used as a test target. The countersunk VIA is subject to plating so that the interior walls and surfaces of the VIA are covered with a conductive material. The plating is removed along the walls of the countersunk section of the VIA, so that the plating remains on the shoulders and the non-countersunk section of the VIA with the shoulder in communication with a trace internal to the PCB. The back-drilled VIA with the plating configuration provides an internal conducting surface for contact while mitigating interference associated with a VIA stub.
1. A method comprising:
drilling a vertical interconnect access (VIA) through a printed circuit board (PCB), the PCB having a first side and a second side;
countersinking the VIA from the first side, the countersinking forming an interior shoulder extending between a first end and a second end, the shoulder located between the first side and the second side in the PCB;
plating the VIA with a conductive material, the plating extending a length of the VIA, including plating the shoulder;
forming a test target in the VIA, including back-drilling the VIA from the first side, the back-drilling removing the conductive material from an interior wall of the VIA extending from the first side to the first end of the plated shoulder, wherein the plated shoulder remains intact in the PCB after back-drilling.
2. The method of claim 1 , further comprising inserting an in-circuit test probe through the first side, including limiting contact of the probe within the VIA to the plated shoulder.
3. The method of claim 2 , wherein back-drilling the VIA includes limiting the conductive plate material remaining within the VIA to the plated shoulder and the interior wall extending from the VIA to the second side of the PCB.
4. The method of claim 3 , wherein the plated shoulder provides a surface to make contact with the tester.
5. The method of claim 4 , further comprising positioning placement of the shoulder during countersinking, the placement position including the shoulder intersecting with a trace internal to the PCB.
6. The method of claim 1 , wherein back-drilling the VIA from the first side further comprising removing a VIA stub formed by plating the VIA.
7. The method of claim 1 , wherein plating the VIA is limited to a single instance.
8. The method of claim 1 , wherein the countersinking further comprises:
forming a first section and a second section, wherein the first section is proximal to the first side of the PCB and the second section is proximal to the second side of the PCB, wherein the shoulder is between the first and second sections and forms an exterior obtuse angle with the first and second sections.
9. The method of claim 1 , wherein the plated shoulder further comprises a plating layer and a PCB layer underneath the plating layer.
10. The method of claim 9 , wherein the plating layer is adjacently positioned to the PCB layer.
11. The method of claim 1 , wherein the shoulder has a first and second end, and the second end is proximal to a trace internal to the PCB.
12. The method of claim 1 , wherein the countersinking occurs before the plating.
13. A vertical interconnect access (VIA) created by the process of:
drilling the VIA through a printed circuit board (PCB), the circuit board PCB having a first side and a second side;
countersinking the VIA from the first side, the countersinking forming an interior shoulder extending between a first end and a second end, the shoulder located between the first side and the second side within the PCB;
plating the VIA with a conductive material, the plating extending a length of the VIA including plating the formed shoulder;
forming a test target in the VIA, including back-drilling the VIA from the first side, the back-drilling removing the conductive material from an interior wall of the VIA extending from the first side to the first end of the plated shoulder, wherein the plated shoulder remains intact in the PCB after back-drilling.
14. The method of claim 8 , wherein the shoulder between the first and second sections remains plated after back-drilling.
15. The method of claim 8 , wherein the first section extends from the first side of the PCB to the intact plated shoulder and the second section extends from the second side of the PCB to the intact plated shoulder.
16. The method of claim 15 , wherein the intact plated shoulder has a length which extends from the first section to the second section.
17. The method of claim 15 , further comprising positioning placement of the interior shoulder in the PCB during countersinking, the placement position including a junction of the interior shoulder in the PCB and the second section, the junction intersecting with a trace internal to the PCB.
18. The method of claim 1 , wherein the interior shoulder in the PCB remains intact after back-drilling.