IP Library Granted Patent US 9,388,972
Granted Patent B2
US 9,388,972 · App. 14/109,378 · Granted Jul 12, 2016

Light source apparatus and projection type display apparatus

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,388,972
App. No.
14/109,378
Granted
Jul 12, 2016
Kind
B2
Abstract

A light source apparatus of the present disclosure includes a semiconductor light source, a light source holding member on which the semiconductor light source is disposed, the light source holding member being made of a thermal conductive material, and a cooling member that radiates heat generated by the semiconductor light source through the light source holding member. In addition, the light source apparatus includes an optical lens, an optical lens holding member that holds the optical lens and that is disposed on a light-emitting portion side of the semiconductor light source, and a thermal conductive member having a hole that houses a light-emitting portion of the semiconductor light source. The thermal conductive member is sandwiched between the light source holding member and the optical lens holding member, and comes into close contact with a side surface of the light-emitting portion.

Claims (23)

1. A light source apparatus comprising:

a semiconductor light source;

a light source holding member on which the semiconductor light source is disposed, the light source holding member being made of a thermal conductive material;

a cooling member that radiates heat generated by the semiconductor light source, through the light source holding member;

an optical lens;

an optical lens holding member holding the optical lens and disposed on a light-emitting portion side of the semiconductor light source; and

a thermal conductive member made of an elastic material and having a hole in which a light-emitting portion of the semiconductor light source is placed, wherein

the thermal conductive member is elastically deformed between the light source holding member and the optical lens holding member, and is in close contact with a side surface of the light-emitting portion by the elastic deformation, and

the optical lens holding member is made of thermal conductivity material, and the light source holding member and the optical lens holding member are joined together with grease having thermal conductivity.

2. The light source apparatus according to claim 1 , wherein the thermal conductive elastic member is made of a silicone material.

3. The light source apparatus according to claim 1 , wherein the thermal conductive member is made of a phase change sheet.

4. The light source apparatus according to claim 1 , wherein the thermal conductive member is provided with at least one or more recesses along a circumference of the hole.

5. The light source apparatus according to claim 1 , wherein the thermal conductive member is provided with another hole in a position different from that of the hole.

6. A projection type display apparatus comprising:

a light source apparatus according to claim 1 ;

an optical modulation apparatus that modulates light from the light source apparatus according to a video signal; and

a projection optical apparatus that projects light from the optical modulation apparatus onto a screen.

7. A method of manufacturing a light source apparatus including a semiconductor light source, the method comprising:

disposing a semiconductor light source on a light source holding member made of a thermal conductive material;

disposing, on the light source holding member, a thermal conductive elastic member which has a hole larger than a diameter of a light-emitting portion of the semiconductor light source and has a thickness larger than a height of the light-emitting portion of the semiconductor light source such that the light-emitting portion of the semiconductor light source is placed in the hole;

sandwiching the thermal conductive elastic member between the light source holding member and an optical lens holding member holding an optical lens; and

elastically deforming the thermal conductive elastic member to be in close contact with a side surface of the light-emitting portion by the elastic deformation,

wherein the optical lens holding member is made of thermal conductivity material, and the light source holding member and the optical lens holding member are joined together with grease having thermal conductivity.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2014
From: NAMBA, SHU
To: PANASONIC CORPORATION
Reel/Frame 032261/0312 →