DISK HAVING AN ELECTRIC CONNECTING ELEMENT
A disk having at least one electric connecting element is described. The disk has a substrate, an electrically conductive structure on a region of the substrate, a connecting element containing at least chromium-containing steel, and a layer of a soldering compound that electrically connects the connecting element to sub-regions of the electrically conductive structure.
1 . A pane with at least one electrical connection element, comprising:
a substrate,
an electrically conductive structure on a region of the substrate,
a connection element, wherein the connection element contains at least a chromium-containing steel, and
a layer of a solder material, wherein the layer of solder material electrically connects the connection element to subregions of the electrically conductive structure.
2 . The pane according to claim 1 , wherein the substrate contains glass, polymers, or mixtures of glass and polymers.
3 . The pane according to claim 1 , wherein a difference between a coefficient of thermal expansion of the substrate and a coefficient of thermal expansion of the connection element is less than 5×10 −6 /° C.
4 . The pane according to claim 1 , wherein the connection element contains at least 50 wt.-% to 89.5 wt.-% iron, 10.5 wt.-% to 20 wt.-% chromium, 0 wt.-% to 1 wt.-% carbon, 0 wt.-% to 5 wt.-% nickel, 0 wt.-% to 2 wt.-% manganese, 0 wt.-% to 2.5 wt.-% molybdenum, or 0 wt.-% to 1 wt.-% titanium.
5 . The pane according to claim 4 , wherein the connection element contains at least 75 wt.-% to 84 wt.-% iron, 16 wt.-% to 18.5 wt.-% chromium, 0 wt.-% to 0.1 wt.-% carbon, 0 wt.-% to 1 wt.-% manganese, or 0 wt.-% to 1 wt.-% titanium.
6 . The pane according to claim 1 , wherein the electrically conductive structure contains silver.
7 . The pane according to claim 1 , wherein a layer thickness of the solder material is less than 3.0×10 −4 m.
8 . The pane according to claim 1 , wherein the solder material contains tin and i) bismuth, ii) indium, iii) zinc, iv) copper, v) silver, or compositions of i)-v).
9 . The pane according to claim 8 , wherein a proportion of tin in the solder material is 3 wt.-% to 99.5 wt.-% and a proportion of i) bismuth, ii) indium, iii) zinc, iv) copper, v) silver, or compositions of i)-v) is 0.5 wt.-% to 97 wt.-%.
10 . The pane according to claim 1 , wherein the connection element is coated with nickel, tin, copper, and/or silver.
11 . The pane according to claim 10 , wherein the connection element is coated with 0.1 μm to 0.3 μm nickel and/or 3 μm to 20 μm silver.
12 . The pane according to claim 1 , wherein the connection element is connected to the subregions of the electrically conductive structure via at least one contact surface over its entire surface.
13 . The pane according to claim 12 , wherein the at least one contact surface has no corners.
14 . A method for production of a pane with at least one electrical connection element, comprising:
a) applying a solder material on at least one contact surface of a connection element as a platelet with a fixed layer thickness, volume, shape, and arrangement,
b) applying an electrically conductive structure on a substrate,
c) arranging the connection element with the solder material on an electrically conductive structure, and
d) soldering the connection element to the electrically conductive structure.
15 . A method comprising:
using the the pane with at least one electrical connection element according to claim 1 , for vehicles with electrically conductive structures, preferably with heating conductors and/or antenna conductors.
16 . The pane according to claim 2 , wherein the glass is flat glass, float glass, quartz glass, borosilicate glass, or soda lime glass.
17 . The pane according to claim 2 , wherein the polymers are polyethylene, polypropylene, polycarbonate, or polymethyl methacrylate.