Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board
View Patent ↗Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D 50 ) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D 50 ) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.
1. A thermosetting resin composition, containing 50 to 70 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler,
wherein the inorganic filler contains: (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles, which have been subjected to a heat resistance process, and magnesium hydroxide particles having an average particle size (D 50 ) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D 50 ) of 1.5 μm or less; (C) a molybdenum compound; (D) boehmite particles having an average particle size (D 50 ) of 0.1 to 0.9 μm,
wherein blending ratios (by volume) of the component (A), the component (B), the component (C) and the component (D) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 30%, component (C): 1 to 10% and component (D): 10 to 30%, and
the resistance process is performed such that a boehmite phase becomes less than 15% of the total, at a 1% dehydration temperature of 250° C. or higher.
2. The thermosetting resin composition according to claim 1 , further containing, as an inorganic filler, (E) inorganic particles having an average particle size (D 50 ) of 0.1 to 15 μm and having a thermal conductivity of 9 W/mK or higher.
3. The thermosetting resin composition according to claim 2 , wherein the inorganic microparticles (E) are magnesium oxide having an average particle size (D 50 ) of 1 to 15 μm and satisfying the formula below:
1 ≦BET/S≦ 5 (Formula 1)
(where BET denotes a BET specific surface area [m 2 /g], and S denotes a theoretical calculated value of specific surface area, in spherical conversion, represented by 6/(average particle size [μm])(density [g/cm 3 ])).
4. The thermosetting resin composition according to claim 2 , wherein blending ratios (by volume) of the component (A), the component (B), the component (C), the component (D) and the component (E) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 50%, component (B): 1 to 20%, component (C): 1 to 10%, component (D): 10 to 30% and component (E): 10 to 50%.
5. A prepreg obtained by impregnating a woven fabric base material with the thermosetting resin composition according to claim 1 .
6. A prepreg obtained by impregnating a nonwoven fabric base material with the thermosetting resin composition according to claim 1 .
7. The prepreg according to claim 5 , wherein a volume ratio of the thermosetting resin composition ranges from 50 to 90 vol %.
8. A laminate obtained by layering and molding of one or a plurality of sheets of the prepreg according to claim 5 .
9. A metal foil-clad laminate, wherein at least one surface of the laminate according to claim 8 is clad with a metal foil.
10. A circuit board obtained by forming a circuit on the metal foil-clad laminate according to claim 9 .