IP Library Granted Patent US 9,190,628
Granted Patent B2
US 9,190,628 · App. 14/117,888 · Granted Nov 17, 2015

Optoelectronic component and method for producing an optoelectronic component

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Quick Facts
Patent No.
US 9,190,628
App. No.
14/117,888
Granted
Nov 17, 2015
Kind
B2
Abstract

An optoelectronic component may include: at least one layer of the optoelectronic component; at least one adhesive on the layer of the optoelectronic component; and a cover on the at least one adhesive; wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer.

Claims (49)

1. An optoelectronic component, comprising:

at least one layer of the optoelectronic component;

at least one adhesive on the layer of the optoelectronic component; and

a cover on the at least one adhesive;

wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer; and

wherein, after being cured, the partial region at least partly encloses a region in which a liquid adhesive is provided, wherein the liquid adhesive is configured to flow into a defect location.

2. The optoelectronic component as claimed in claim 1 ,

wherein the partial region comprises the edge region of the at least one adhesive.

3. The optoelectronic component as claimed in claim 2 ,

wherein the edge region is at least one part of a circumferential structure of the at least one adhesive.

4. The optoelectronic component as claimed in claim 1 ,

wherein the partial region is arranged at least partly laterally outside an active region of the optoelectronic component.

5. The optoelectronic component as claimed in claim 1 ,

wherein the at least one adhesive comprises a plurality of adhesives of differing viscosity.

6. The optoelectronic component as claimed in claim 1 ,

wherein particles are provided in the adhesive, said particles having a different refractive index than the adhesive.

7. The optoelectronic component as claimed in claim 1 ,

wherein the adhesive has a lower refractive index than the cover.

8. The optoelectronic component as claimed in claim 1 ,

wherein an optically refractive layer is provided on at least one surface of the cover.

9. The optoelectronic component as claimed in claim 1 , designed as a light emitting diode.

10. The optoelectronic component as claimed in claim 1 , designed as an organic light emitting diode.

11. The optoelectronic component as claimed in claim 1 ,

wherein the layer comprises an encapsulation layer of the optoelectronic component.

12. The optoelectronic component as claimed in claim 1 ,

wherein the cover comprises glass.

13. The optoelectronic component as claimed in claim 1 ,

wherein the cover comprises a film.

14. The optoelectronic component as claimed in claim 1 ,

wherein the partial region at least partly encloses a region in which a liquid non-adhesive material is provided.

15. An optoelectronic component, comprising:

at least one layer of the optoelectronic component;

at least one adhesive on the layer of the optoelectronic component; and

a cover on the at least one adhesive;

wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer; and

wherein the partial region at least partly encloses a region in which a liquid non-adhesive material is provided.

16. The optoelectronic component as claimed in claim 15 ,

wherein the at least one adhesive is cured in a partial region that at least partially encloses a region comprising the at least one adhesive in a liquid, uncured form.

17. The optoelectronic component as claimed in claim 15 ,

wherein particles are provided in the at least one adhesive, said particles having a different refractive index than the at least one adhesive.

18. A method for producing an optoelectronic component,

wherein the method comprises:

applying a cover to a layer of the optoelectronic component by means of at least one adhesive; and

varying the viscosity of the at least one adhesive only in a partial region above a substrate of the optoelectronic component and above the layer;

wherein, after varying the viscosity, the partial region at least partly encloses a region in which a liquid adhesive remains, wherein the liquid adhesive is configured to flow into a defect location.

19. The method as claimed in claim 18 ,

wherein the viscosity is varied by means of light irradiation.

20. The method as claimed in claim 19 ,

wherein the light irradiation is effected by means of irradiation by ultraviolet light.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2020
From: OSRAM OLED GMBH
To: DOLYA HOLDCO 5 LIMITED
Reel/Frame 053464/0374 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 11/658.772 REPLACED 11/658.772 PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 053464 FRAME: 0395. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 11, 2020
From: DOLYA HOLDCO 5 LIMITED
To: PICTIVA DISPLAYS INTERNATIONAL LIMITED
Reel/Frame 053464/0395 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT US APP. NO PREVIOUSLY RECORDED AT REEL: 034679 FRAME: 0195. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 27, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 052756/0621 →
SPIN-OFF OF THE ORIGINAL ASSIGNEE Recorded Dec 11, 2014
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 034679/0195 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2013
From: BECKER, DIRK; LANG, ERWIN; SETZ, DANIEL STEFFEN
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 031608/0308 →