Optoelectronic device and method for producing optoelectronic devices

1. An optoelectronic device comprising:

an optoelectronic component that receives or generates radiation;

a frame having a cavity, the optoelectronic component arranged in said cavity;

a connection carrier to which the optoelectronic component is fixed, wherein the connection carrier is a circuit board and has a plated through hole through the connection carrier, the plated through hole being an opening for an air exchange between the cavity and the environment;

a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component,

an ambient light sensor, wherein the cover defines a shortwave edge of the sensitivity of the sensor, and

a filter that defines the longwave edge of the sensitivity distribution such that the sensitivity distribution of the ambient light sensor simulates a sensitivity distribution of a human eye.

2. The optoelectronic device according to claim 1 , wherein the connection carrier is arranged on a side of the frame facing away from the cover.

3. The optoelectronic device according to claim 1 , further comprising contact areas for the external electrical contact-making on a side facing away from the radiation passage area, and the contact areas electrically connect to the optoelectronic component via plated-through holes through the connection carrier.

4. The optoelectronic device according to claim 1 , wherein the cover is a film containing a polyimide.

5. The optoelectronic device according to claim 1 , wherein the frame, the connection carrier and the cover terminate flush at least along one direction.

6. The optoelectronic device according to claim 1 , wherein the cavity has an undercut region in a direction running from the cover to the optoelectronic component.

7. The optoelectronic device according to claim 1 , wherein the cavity has a region that tapers at least regionally from the cover in a direction of the optoelectronic component.

8. The optoelectronic device according claim 1 , further comprising a further optoelectronic component, which together with the optoelectronic component forms an emitter-detector pair.

9. The optoelectronic device according to claim 8 , wherein the further optoelectronic component is arranged in a further cavity and the further cavity is spaced apart from the cavity.

10. The optoelectronic device according to claim 1 , which is a proximity sensor and an ambient light sensor.

11. The optoelectronic device according to claim 1 , further comprising a further optoelectronic component, wherein the further optoelectronic component is the ambient light sensor.

12. The optoelectronic device according to claim 1 , wherein the plated through hole is a cutout whose side areas are provided with an electrically conductive contact coating, said contact coating electrically connected to contact areas formed on a rear side of the connection carrier facing away from the optoelectronic component.

13. The optoelectronic device according to claim 1 , wherein the covering is a film that withstands temperature loads of at least 250° C.

14. The optoelectronic device according to claim 1 , wherein the ambient light sensor is an integrated circuit having a photosensitive region.

15. A method of producing a plurality of optoelectronic devices comprising:

a) providing a connection carrier assemblage;

b) arranging optoelectronic components on the connection carrier assemblage;

c) positioning a frame element having a plurality of cavities on the connection carrier assemblage such that the optoelectronic components are respectively arranged in a cavity;

d) arranging a cover on the frame element; and

e) severing the connection carrier assemblage into a plurality of connection carriers on each of which at least one optoelectronic component and a frame having a cavity is arranged, wherein each connection carrier is a circuit board and comprises a plated through hole that is an opening for air exchange between the cavities and the surrounding environment,

wherein the optoelectronic devices comprise an ambient light sensor, and a filter that defines the longwave edge of the sensitivity distribution such that the sensitivity distribution of the ambient light sensor simulates a sensitivity distribution of a human eye, and the cover defines a shortwave edge of the sensitivity of the ambient light sensor.

16. The method according to claim 15 , wherein the cover, the frame element and the connection carrier assemblage are severed in e).