Optoelectronic semiconductor chip
View Patent ↗An optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. The semiconductor body includes an active layer intended for generating radiation. The semiconductor body includes a p-side and an n-side, between which the active layer is arranged. The p-contact layer is intended for electrical contacting the p-side. The n-contact layer is intended for electrical contacting the n-side 1 b . The n-contact layer contains a TCO layer and a mirror layer, the TCO-layer being arranged between the n-side of the semiconductor body and the mirror layer.
1. An optoelectronic semiconductor chip comprising:
a semiconductor body of semiconductor material, wherein the semiconductor body comprises an active layer configured to generate radiation, and wherein the semiconductor body comprises a p-side and an n-side, the active layer being arranged between the p-side and the n-side;
a p-contact layer, wherein the p-contact layer electrically contacts the p-side of the semiconductor body; and
an n-contact layer,
wherein the n-contact layer electrically contacts the n-side of the semiconductor body,
wherein the n-contact layer contains a TCO layer and a mirror layer,
wherein the mirror layer contains silver,
wherein the n-contact layer passes through the p-side via a hole and ends in the n-side of the semiconductor body, and
wherein the TCO layer is arranged in the hole between the n-side of the semiconductor body and the mirror layer.
2. The optoelectronic semiconductor chip according to claim 1 , wherein the p-contact layer and the n-contact layer are arranged on the same side of the semiconductor body.
3. The optoelectronic semiconductor chip according to claim 2 ,
wherein the p-side of the semiconductor body directly adjoins a first side of the p-contact layer,
wherein the n-contact layer is arranged on a second side of the p-contact layer, the second side being remote from the semiconductor body, and
wherein the semiconductor chip further comprises an electrically insulating layer arranged between the p-contact layer and the n-contact layer.
4. The optoelectronic semiconductor chip according to claim 2 , wherein the n-contact layer passes to the n-side through the p-contact layer and through the p-side of the semiconductor body.
5. The optoelectronic semiconductor chip according to claim 1 , wherein the TCO layer comprises zinc oxide.
6. The optoelectronic semiconductor chip according to claim 1 , wherein the TCO layer comprises indium tin oxide.
7. The optoelectronic semiconductor chip according to claim 1 , wherein the TCO layer comprises a material selected from the group consisting of tin oxide, aluminum zinc oxide, aluminum tin oxide, gallium tin oxide, gallium zinc oxide or indium zinc oxide.
8. The optoelectronic semiconductor chip according to claim 1 , wherein the TCO layer has a thickness of greater than 0.5 nm.
9. The optoelectronic semiconductor chip according to claim 1 , wherein the TCO layer has a thickness in a range between 15 nm and 25 nm, inclusive.
10. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor body comprises oblique side faces.
11. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor body comprises GaN.
12. The optoelectronic semiconductor chip according to claim 1 ,
wherein the n-contact layer passes through the p-side via a plurality of holes and ends in the n-side of the semiconductor body; and
wherein the TCO layer is arranged in the plurality of holes between the n-side of the semiconductor body and the mirror layer.
13. The optoelectronic semiconductor chip according to claim 4 , wherein the mirror layer passes through a hole in the p-side of the semiconductor body.
14. The optoelectronic semiconductor chip according to claim 1 , wherein the n-contact layer passes through the p-side via a plurality of holes, each of the holes ending in the n-side of the semiconductor body, and wherein the TCO layer is arranged in the plurality of holes between the n-side of the semiconductor body and the mirror layer.
15. The optoelectronic semiconductor chip according to claim 1 , wherein the hole projects into the n-side of the semiconductor body.
16. The optoelectronic semiconductor chip according to claim 1 , wherein the mirror layer essentially consists of silver, and wherein the mirror layer directly adjoins the TCO layer at any position within the hole.
17. The optoelectronic semiconductor chip according to claim 1 , wherein the p-contact layer projects beyond the semiconductor body in a direction running in parallel to the active layer.
18. The optoelectronic semiconductor chip according to claim 1 , wherein the mirror layer completely covers the semiconductor body.
19. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor chip comprises a carrier on which the semiconductor body is arranged, and wherein an electrical connection layer for electrically contacting the n-side is arranged on a side of the carrier facing away from the semiconductor body.