Method of manufacturing a nonvolatile memory device having a variable resistance element whose resistance value changes reversibly upon application of an electric pulse
View Patent ↗A method of manufacturing a nonvolatile memory device includes: forming a first electrode; forming, above the first electrode, a metal oxide material layer including a first metal oxide; forming a mask above part of the metal oxide material layer main surface; forming, in a region of the metal oxide material layer not covered by the mask, a high oxygen concentration region including a second metal oxide having a lower degree of oxygen deficiency than the first metal oxide; removing the mask; forming, above a first variable resistance layer including the high oxygen concentration region and a low oxygen concentration region that is a region of the metal oxide material layer other than the high oxygen concentration region, a second variable resistance layer including a third metal oxide having a lower degree of oxygen deficiency than the first metal oxide; and forming a second electrode above the second variable resistance layer.
1. A method of manufacturing a nonvolatile memory device, the method comprising:
forming a first electrode;
forming, above the first electrode, a metal oxide material layer comprising a first metal oxide;
forming a mask above a portion of a main surface of the metal oxide material layer;
forming, in a region of the metal oxide material layer not covered by the mask, a high oxygen concentration region comprising a second metal oxide having a degree of oxygen deficiency lower than a degree of oxygen deficiency of the first metal oxide, to form a first variable resistance layer including the metal oxide material layer in which the high oxygen concentration region is formed;
removing the mask;
forming, above the first variable resistance layer, a second variable resistance layer comprising a third metal oxide having a degree of oxygen deficiency lower than the degree of oxygen deficiency of the first metal oxide; and
forming a second electrode above the second variable resistance layer.
2. The method according to claim 1 ,
wherein in the forming of a high oxygen concentration region, the region of the metal oxide material layer not covered by the mask is oxidized.
3. The method according to claim 1 ,
wherein the forming of a high oxygen concentration region and the removing of the mask are performed concurrently.
4. The method according to claim 1 ,
wherein the forming of a second variable resistance layer is performed by a reactive sputtering method in an oxygen atmosphere.
5. The method according to claim 3 ,
wherein the forming of a second variable resistance layer is performed immediately following the forming of a high oxygen concentration region and the removing of the mask, using a device that concurrently performs the forming of a high oxygen concentration region and the removing of the mask.
6. The method according to claim 1 ,
wherein when a plurality of variable resistance elements each including the first electrode, the first variable resistance layer, the second variable resistance layer, and the second electrode are to be formed,
in the forming of a mask, the mask is formed to be shared by a plurality of neighboring ones of the variable resistance elements.
7. The method according to claim 1 ,
wherein in the forming of a high oxygen concentration region, the high oxygen concentration region is formed to have a film thickness smaller than a film thickness of the metal oxide material layer.