IP Library Granted Patent US 9,077,171
Granted Patent B2
US 9,077,171 · App. 14/122,538 · Granted Jul 7, 2015

Ground loss monitoring circuit and integrated circuit comprising the same

Inventors: Philippe Givelin (Leguevin, FR); Patrice Besse (Tournefeuille, FR); Estelle Huynh (Toulouse, FR)
Assignee: Freescale Semiconductor, Inc.
H02H1/0007G01R31/025G01R31/2853G01R31/2884
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Quick Facts
Patent No.
US 9,077,171
App. No.
14/122,538
Granted
Jul 7, 2015
Kind
B2
Abstract

A reference voltage loss monitoring circuit having a first and second reference node. The reference nodes are connected to a voltage reference. A first connection device is connects the first reference node to the second reference node, and includes a first diode to allow a current flowing from the first reference node to the reference ground node and not conversely. The first diode includes a first main transistor. A second connection device connects the second reference node to the first reference node, and includes a second diode to allow a current flowing from the second reference node to first reference node and not conversely. The second diode includes a second main transistor. Each of the first and second connection devices further includes a secondary transistor mirrored with the main transistor of the connection devices. The secondary transistor has an output coupled to a diagnostic circuit, for delivering to the diagnostic circuit a signal indicative of a loss of voltage reference on a respective reference node.

Claims (36)

1. A reference voltage loss monitoring circuit comprising:

a first reference node and a second reference node, said reference nodes connected to a voltage reference,

a first connection device arranged to connect the first reference node to the second reference node, comprising at least a first diode arranged to allow a current flowing from said first reference node to said second reference node and not conversely, said first diode comprising a first main transistor connected to operate as a diode,

a second connection device arranged to connect the second reference node to the first reference node, comprising at least a second diode arranged to allow a current flowing from said second reference node to first reference node and not conversely, said second diode comprising a second main transistor connected to operate as a diode,

each of the first and second connection devices further comprises a secondary transistor mirrored with the main transistor of said first and second connection devices respectively,

the secondary transistor comprising an output arranged to be coupled to a diagnostic circuit, for delivering to said diagnostic circuit a signal indicative of a loss of voltage reference on a respective reference node.

2. The monitoring circuit of claim 1 , in which said main transistors are bipolar transistors, each comprising a collector, a drain and a base, and wherein the collector or the drain of the first main transistor is connected to the base, of the first main transistor, and in which the collector or the drain of the second main transistor is connected to the base of the second main transistor.

3. The monitoring circuit according to claim 1 , wherein the secondary transistor and the main transistors each comprise:

a pair of current terminals; and

a control terminal, wherein

the control terminal of the first secondary transistor is connected to the control terminal of the first main transistor, and

the control terminal of the second secondary transistor is connected to the control terminal of the second main transistor.

4. The monitoring circuit according to claim 1 , further comprising a main filter, positioned between the main transistor and the secondary transistor, and arranged to filter from said signal components caused by a ESD discharge or a EMC spike.

5. The monitoring circuit according to claim 1 , further comprising a buffer stage comprising an auxiliary transistor connected to the secondary transistor.

6. The monitoring circuit of claim 5 , wherein the secondary transistor and the auxiliary transistor both comprise a pair of current terminals and a control terminal, and further comprising an auxiliary filter, arranged to filter from said signal components causes by a loss of voltage of a duration shorter than a predetermined threshold duration.

7. The monitoring circuit according to claim 1 , wherein each of said main transistors comprises a pair of current terminals and a control terminal, and further comprising a EMC capacitor interposed between the control terminal and a current terminal of the main transistor and arranged to reduce an amplitude of incoming electrical spikes.

8. The monitoring circuit according to claim 1 , in which the main transistor is a N-type transistor.

9. The monitoring circuit according to claim 8 , in which the main N-type transistor is one of the group consisting of: N-channel FET transistor, NPN bipolar transistor.

10. The monitoring circuit according to claim 1 , further comprising:

a third reference node connected to the voltage reference, wherein

a third connection device is arranged between the second reference node and the third reference node,

a fourth connection device is arranged between the third reference node and the second reference node,

a fifth connection device is arranged between the third reference node and the first reference node, and

a sixth connection device is arranged between the first reference node and the third reference node.

11. An integrated circuit, comprising two or more reference nodes and a monitoring circuit according to claim 1 .

12. The integrated circuit of claim 11 , comprising a die with a surface layer comprising at least two contact pads forming said reference node, said contact pads being connectable to a voltage source external to the die, and a substrate below said surface layer, said monitoring circuit being present in said substrate and situated underneath the contact pads.

13. A control device, comprising a monitoring circuit according to claim 1 and a diagnostic circuit.

14. The monitoring circuit according to claim 2 , wherein the secondary transistor and the main transistors each comprise:

a pair of current terminals; and

a control terminal, wherein

the control terminal of the first secondary transistor is connected to the control terminal of the first main transistor, and

the control terminal of the second secondary transistor is connected to the control terminal of the second main transistor.

15. The monitoring circuit according to claim 14 , further comprising a main filter, positioned between the main transistor and the secondary transistor, and arranged to filter from said signal components caused by a ESD discharge or a EMC spike.

16. The monitoring circuit according to claim 14 , further comprising a buffer stage comprising an auxiliary transistor connected to the secondary transistor.

17. The monitoring circuit of claim 16 , wherein the secondary transistor and the auxiliary transistor both comprise a pair of current terminals and a control terminal, and further comprising an auxiliary filter arranged to filter from said signal components causes by a loss of voltage of a duration shorter than a predetermined threshold duration.

18. The monitoring circuit according to claim 16 , wherein each of said main transistors comprises a pair of current terminals and a control terminal, and further comprising a EMC capacitor interposed between the control terminal and a current terminal of the main transistor and arranged to reduce an amplitude of incoming electrical spikes.

Assignments (18)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0790 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., COLLATERAL AGENT
Reel/Frame 032445/0689 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0577 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2013
From: GIVELIN, PHILIPPE; BESSE, PATRICE; HUYNH, ESTELLE
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 031680/0676 →
Continuity (1)
Related Publication 20140092500A1 · Apr 3, 2014