Microcircuit module of reduced size and smart card comprising same
View Patent ↗A microcircuit module for a smart card includes a generally rectangular carrier film ( 101 ) provided with eight contact pads on a first face thereof and with an electronic component on a second face, the electronic component being equipped with connection terminals to which the contact pads are connected via the carrier film. The eight contact pads are disposed in two parallel series of three contact pads (C 1 , C 2 , C 3 , C 5 , C 6 , C 7 ), with two other contact pads (C′ 4 , C′ 8 ) being disposed therebetween and each being positioned close to the contact pads from the ends of each of the series. The contact pads each measure at least 1.7 mm×2 mm. The contact pads of the two parallel series comply with ISO standard 7816 and the eight contact pads border each of the sides of the carrier film.
1. Smart card microcircuit module comprising:
a carrier film ( 101 , 201 ) of overall rectangular shape provided on a first face with a total of eight contact pads suitable for being brought in contact with an external element and, on a second face, with an electronic component ( 205 ) equipped with connecting terminals ( 210 ) to which the contact pads are connected through the carrier film, these eight contact pads being arranged in two parallel series of three contact pads (C 1 , C 2 , C 3 , C 5 , C 6 , C 7 ) between which two other contact pads (C′ 4 , C′ 8 ) are situated, these series of contact pads each being aligned parallel to one and the same direction of the carrier film in such a way that the contact pads of one of the series are respectively opposite, transversely to said direction, to the contact pads of the other of the series, the other two contact pads being respectively positioned near the contact pads forming the ends of each of the series, the contact pads each having, parallel to said direction, a dimension of at least 1.7 mm and, transversely to this direction, a dimension of at least 2 mm, the contact pads of the two parallel series complying with the provisions of standard ISO 7816 as regards the pads denoted C 1 to C 3 and C 5 to C 7 in this standard, these eight contact pads jointly bordering each of the sides of the carrier film.
2. Module according to claim 1 , characterized in that the component is mounted by flip-chip assembly, the carrier film having, on said other face, electrically conducting tracks ( 207 ) respectively connected to the eight contact pads through the carrier film and having connecting pads ( 211 ) opposite the connecting terminals of the component to which they are fixed.
3. Module according to claim 2 , characterized in that the mechanical bond provided by the electrical connection is supplemented with an interposed material ( 212 ) filling the space between this carrier film and the opposite face the component.
4. Module according to claim 1 , characterized in that the carrier film comprises, on its first face, a reinforcing zone (Z) facing, through this film, the whole component.
5. Module according to claim 4 , characterized in that the contact pads arranged on the first face of the carrier film are formed within a metallic layer, the reinforcing zone has the same thickness and the same composition as the contact pads.
6. Module according to claim 5 , characterized in that the reinforcing zone is integral with one of said other contact pads (C′ 4 , C′ 8 ).
7. Module according to claim 5 , characterized in that the reinforcing zone is integral with one of the contact pads (C 1 , C 2 , C 3 , C 5 , C 6 , C 7 ) of one of the series.
8. Module according to claim 5 , characterized in that the reinforcing zone (Z) is electrically insulated with respect to each of the contact pads.
9. Module according to claim 4 , characterized in that the reinforcing zone is integral with one of said other contact pads (C′ 4 , C′ 8 ).
10. Module according to claim 4 , characterized in that the reinforcing zone is integral with one of the contact pads (C 1 , C 2 , C 3 , C 5 , C 6 , C 7 ) of one of the series.
11. Module according to claim 4 , characterized in that the reinforcing zone (Z) is electrically insulated with respect to each of the contact pads.
12. Module according to claim 11 , characterized in that the reinforcing zone has, parallel to said direction of the carrier film, a dimension greater than that of the contact pads located in the middle of the series of contact pads.
13. Module according to claim 1 , characterized in that said other two contact pads (C′ 4 , C′ 8 ) are dedicated to a USB communication function.
14. Module according to claim 1 , characterized in that the connecting terminals ( 210 ) of the component to which the eight contact pads are connected are distributed in two parallel series of four connecting terminals.
15. Smart card comprising a module according to claim 1 , comprising a card body ( 104 , 204 ) in which a cavity is made that has a deep part ( 204 B) suitable for receiving the electronic component, which is surrounded by a peripheral part ( 204 A) of smaller depth to which the module is fixed by its periphery.
16. Card according to claim 15 , characterized in that all eight contact pads are opposite this peripheral part.
17. Card according to claim 16 , the body of which has dimensions smaller than those of the 3FF format.
18. Card according to claim 15 , the body of which has dimensions smaller than those of the 3FF format.
19. Reader configured for connecting to at least one of said other contact pads (C′ 4 , C′ 8 ) of a module as defined by claim 1 .
20. Smart card microcircuit module comprising: a carrier film ( 101 , 201 ) of overall rectangular shape provided on a first face with eight contact pads suitable for being brought in contact with an external element and, on a second face, with an electronic component ( 205 ) equipped with connecting terminals ( 210 ) for connection through the carrier film, these eight contact pads being arranged in two parallel series of three contact pads (C 1 , C 2 , C 3 , C 5 , C 6 , C 7 ) between which two other contact pads (C′ 4 , C′ 8 ) are situated, these series of contact pads each being aligned parallel to one and the same direction of the carrier film in such a way that the contact pads of one of the series are respectively opposite, transversely to said direction, to the contact pads of the other of the series, the other two contact pads being respectively positioned near the contact pads forming the ends of each of the series, the contact pads each having, parallel to said direction, a dimension of at least 1.7 mm and, transversely to this direction, a dimension of at least 2 mm, the contact pads of the two parallel series complying with the provisions of standard ISO 7816 as regards the pads denoted C 1 to C 3 and C 5 to C 7 in this standard, these eight contact pads jointly bordering each of the respective sides of the carrier film and each being adjacent to two others of the eight contact pads and electrically insulated therefrom.