Power module and power conversion apparatus using same
View Patent ↗A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member.
1. A power module comprising:
a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit;
a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices; and
a module case configured to accommodate the semiconductor devices and the conductive plates,
wherein the module case includes,
a heat radiation member made of plate-like metal and facing a surface of the conductive plate, and
a metallic frame body having an opening portion that is closed by the heat radiation member,
wherein a heat radiation fin unit having a plurality of heat radiation fins vertically arranged thereon is provided at a center of the heat radiation member, and a joint portion with the frame body is provided at an external peripheral edge of the heat radiation member, and
the heat radiation member has a thermal conductivity higher than that of the frame body, and the frame body is of a higher rigidity than that of the heat radiation member.
2. The power module according to claim 1 , wherein the heat radiation member is a first heat sink and a second heat sink arranged to face each other.
3. The power module according to claim 2 , wherein the first heat sink and the second heat sink have a fin peripheral edge unit provided to enclose the heat radiation fin unit between the joint portion and the heat radiation fin unit of them each, and
when pressure is applied to the first heat sink and the second heat sink from an external side toward inside of the module case, bending rigidity of the peripheral edge unit of the first heat sink is configured to be less than bending rigidity of the peripheral edge unit of the second heat sink, so that the peripheral edge unit of the first heat sink is preferentially deformed.
4. The power module according to claim 3 , wherein a thickness of the fin peripheral edge unit of the first heat sink is thinner than a thickness of the fin peripheral edge unit of the second heat sink.
5. The power module according to claim 2 , wherein the plurality of conductive plates include a first conductive plate connected via a metal bonding material with an electrode surface of the semiconductor device, a second conductive plate connected via the metal bonding material with the other electrode surface of the semiconductor device,
a module primary encapsulant body made by sealing the semiconductor device, the first conductive plate, and the second conductive plate with an encapsulant and the module case are crimped with an insulating member, and
a portion of the first and second conductive plates is exposed from the encapsulant so as to be in contact with the insulating member.
6. The power module according to claim 2 , wherein the frame body and the first heat sink, and the frame body and the second heat sink are joined by fused junction or solid-state welding.
7. A power conversion apparatus configured to convert electric power from a direct current to an alternate current or from an alternate current to a direct current, using switching operation of a semiconductor device, the power conversion apparatus comprising:
the power module according to claim 2 ; and
a channel forming body configured to from a cooling channel in which coolant flows, wherein
the power module has first and second heat sinks arranged in the cooling channel and performs heat exchange with a coolant flowing in the cooling channel, so that heat from the semiconductor device is radiated to the coolant.
8. The power conversion apparatus according to claim 7 , wherein the channel forming body is formed with an opening portion in communication with the cooling channel,
the power module includes
a cylindrical unit in a cylindrical shape having a bottom; and
a flange portion formed in an opening of the cylindrical unit and fixed to the channel forming body to close the opening portion of the channel forming body,
wherein the cylindrical unit is formed by joining the first heat sink and the second heat sink to the frame body, and
a heat radiation fin provided on each of the first heat sink and the second heat sink is vertically arranged to protrude in the cooling channel.