CURABLE COMPOSITIONS
Embodiments include curable compositions including an epoxy resin and a hardener component including a terpolymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.
1 . A curable composition, comprising:
an epoxy resin; and
a hardener compound for curing with the epoxy resin, the hardener compound comprising:
a terpolymer having a first constitutional unit of the formula (I):
a second constitutional unit of the formula (II):
and a third constitutional unit of the formula (III):
where each m, n and r is independently a real number that represents a mole fraction of the respective constitutional unit in the terpolymer, each R is independently a hydrogen, an aromatic group or an aliphatic group, Ar is an aromatic radical, and where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0.
2 . The curable composition of claim 1 , where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.1:1.0 to 1.9:1.0.
3 . The curable composition of claim 1 , where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.3:1.0 to 1.7:1.0.
4 . The curable composition of claim 1 , where the mole fraction m is 0.50 or greater and the mole fractions n and r are each independently 0.45 to 0.05, and where (m+n+r)=1.00.
5 . The curable composition of claim 1 , where the curable composition does not contain a cyanate group.
6 . The curable composition of claim 1 , where a cured product of the curable composition has a glass transition temperature of at least 150° C.
7 . The curable composition of claim 1 , where a cured product of the curable composition has a dielectric constant (D k ) of 3.1 or less at a frequency of 1 GHz.
8 . The curable composition of claim 1 , where a cured product of the curable composition has a dissipation factor (D f ) of 0.01 or less at a frequency of 1 GHz.
9 . The curable composition of claim 1 , where each R is independently a hydrogen, an aromatic group or an aliphatic group, and Ar is a group representing a monocyclic or a polycyclic aromatic or heteroaromatic ring.
10 . The curable composition of claim 1 , where the first constitutional unit to the second constitutional unit has a molar ratio in a range of 1:1 to 20:1.
11 . The curable composition of claim 1 , where the molar ratio of the first constitutional unit to the second constitutional unit is in a range of 3:1 to 15:1.
12 . The curable composition of claim 1 , where the second constitutional unit constitutes 0.1 percent (%) to 41% by weight of the terpolymer.
13 . The curable composition of claim 1 , where the second constitutional unit constitutes 5% to 20% by weight of the terpolymer.
14 . The curable composition of claim 1 , where the third constitutional unit constitutes 0.1% to 62.69% by weight of the terpolymer.
15 . The curable composition of claim 1 , where the third constitutional unit constitutes 0.5% to 50% by weight of the terpolymer.
16 . The curable composition of claim 1 , where the epoxy resin is selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof.
17 . A prepreg that includes a reinforcement component and the curable composition of claim 1 .
18 . An electrical laminate structure that includes a reaction product of the curable composition of claim 1 .
19 . A method of preparing a curable composition, comprising:
providing an epoxy resin; and
reacting the epoxy resin with a hardener compound, the hardener compound comprising:
a terpolymer having a first constitutional unit of the formula (I):
a second constitutional unit of the formula (II):
and a third constitutional unit of the formula (III):
where each m, n and r is independently a real number that represents a mole fraction of the respective constitutional unit in the terpolymer, each R is independently a hydrogen, an aromatic group or an aliphatic group, Ar is an aromatic radical, and where the epoxy group to the second constitutional unit has a molar ratio in a range of 1.0:1.0 to 2.7:1.0.
20 . The method of preparing a curable composition of claim 19 , comprising excluding a cyanate group from the curable composition.