Organic light emitting diode, method for producing an organic light emitting diode and module comprising at least two organic light emitting diodes

1. An organic light emitting diode comprising:

a substrate,

an organic layer sequence configured to generate electromagnetic radiation during operation, wherein the organic layer sequence is arranged in a central region of the substrate;

a metallization is arranged in an edge region of the substrate and designed to make electrical contact with the organic layer sequence; and

a separately produced metallic contact structure, which is cohesively and electrically conductively connected to the metallization by a joining process based on ultrasonic technology;

wherein the contact structure has a main extension plane arranged parallel to main area of the substrate; and

wherein the contact structure is cohesively and electrically conductively connected to the metallization at at least one connecting point, wherein the contact structure has a main structure in which the at least one connecting point is embedded, and wherein the at least one connecting point comprises a material that is different from a material of the main structure.

2. The organic light emitting diode according to claim 1 , wherein the contact structure comprises a material selected from the group consisting of aluminum, copper, brass, zinc, bronze, tin, silver and gold.

3. The organic light emitting diode according to claim 1 , wherein the contact structure has a contact region configured to make electrical contact externally.

4. The organic light emitting diode according to claim 3 , wherein the contact region is designed as a lug, as an eye or as a wire.

5. A method for producing an organic light emitting diode, the method comprising:

providing a substrate, wherein an organic layer sequence is arranged in a central region of the substrate, the organic layer sequence generating electromagnetic radiation during operation, and where a metallization is arranged in an edge region of the substrate, the metallization being designed to make electrical contact with the organic layer sequence,

producing a metallic contact structure, and

cohesively connecting the contact structure to the metallization, in such a way that an electrically conductive connection arises between the contact structure and the metallization;

wherein the contact structure has a main extension plane arranged parallel to main area of the substrate; and

wherein the contact structure is cohesively and electrically conductively connected to the metallization at at least one connecting point, wherein the contact structure has a main structure in which the at least one connecting point is embedded, and wherein the at least one connecting point comprises a material that is different from a material of the main structure.

6. The method according to claim 5 , wherein the contact structure is produced from a metal tape.

7. The method according to claim 6 , wherein the contact structure is stamped from the metal tape.

8. The method according to claim 5 , wherein the contact structure is produced from a metal tape having a main body, into which is embedded a material that differs from the material of the main body.

9. The method according to claim 5 , wherein the contact structure is cohesively connected to the metallization by a joining process based on ultrasonic technology.

10. A module comprising at least two organic light emitting diodes, wherein

each organic light emitting diode has a metallization in an edge region of a substrate, each metallization being designed for making electrical contact with an organic layer sequence;

the two organic light emitting diodes are electrically conductively connected to one another via a separately produced metallic contact structure that is cohesively connected to at least one of the metallizations;

wherein each contact structure has a main extension plane arranged parallel to main area of the substrate; and

wherein each contact structure is cohesively and electrically conductively connected to the metallization at at least one connecting point, wherein each contact structure has a main structure in which the at least one connecting point is embedded, and wherein the at least one connecting point comprises a material that is different from a material of the main structure.

11. The module according to claim 10 ,

wherein each organic light emitting diode has a contact structure and a metallization, wherein the contact structure is cohesively and electrically conductively connected to the metallization; and

wherein each contact structure has a lug via which the organic light emitting diodes are electrically conductively connected.

12. The module according to claim 11 , wherein the lugs are electrically conductively connected to one another by clamps or contact springs.

13. The module according to claim 11 , wherein the lugs are designed as eyes whose openings are electrically conductively connected for the purpose of making electrical contact.

14. The module according to claim 10 , wherein each organic light emitting diode is introduced into an insert of a frame, wherein a contact spring is arranged at each insert, the contact spring becoming located on the contact structure in the course of the organic light emitting diode being latched in, such that an electrically conductive connection arises between the contact structure and the contact spring.