Housing for a semiconductor chip and semiconductor chip with a housing
View Patent ↗A housing for a semiconductor chip has an injection molded body, in which an accommodating area for accommodating the semiconductor chip is provided. The injection-molded body has at least one metallization for making electrical contact with the semiconductor chip.
1. A housing for a semiconductor chip, the housing comprising:
an injection-molded body, in which an accommodating area for accommodating the semiconductor chip is provided, wherein the injection-molded body has a metallization configured to make electrical contact with the semiconductor chip; and
an opening leading into the accommodating area, wherein the opening is closed by a membrane or a valve.
2. The housing according to claim 1 , wherein the metallization is arranged at least partly on a surface of the injection-molded body.
3. The housing according to claim 1 , wherein the metallization is arranged at least partly in the accommodating area.
4. The housing according to claim 1 , wherein the metallization leads at least partly through the injection-molded body.
5. The housing according to claim 1 , wherein the metallization is arranged at least partly outside the accommodating area.
6. The housing according to claim 1 , wherein the injection-molded body has a metallization arranged in the accommodating area, has a metallization embodied as plated-through hole leading through the injection-molded body, and has a metallization arranged outside the accommodating area, wherein the plated-through hole electrically connects the metallization in the accommodating area to the metallization outside the accommodating area.
7. The housing according to claim 1 , wherein the metallization is provided at least partly in the accommodating area and leads out of the accommodating area along a surface of the injection-molded body.
8. The housing according to claim 1 , further comprising a cover configured to close the accommodating area.
9. The housing according to claim 1 , wherein the metallization leads out of the accommodating area, wherein the opening leads into the accommodating area at one side of the housing, and wherein the metallization leads out of the accommodating area at another side.
10. A semiconductor chip with a housing according to claim 1 , wherein the semiconductor chip is arranged in the accommodating area of the housing.
11. The housing according to claim 1 , further comprising a cover, wherein the cover is located opposite to a connection region, and wherein the connection region comprises a feed line configured to feed a fluid medium onto the semiconductor chip.
12. The housing according to claim 1 , wherein the injection-molded body is designed as an molded interconnect device (MID).
13. The housing according to claim 8 , wherein the accommodating area is hermetically impermeably sealed.
14. The housing according to claim 9 , further comprising a cover that closes the accommodating area, wherein the opening is arranged in the cover, and the metallization is arranged at a base of the housing.
15. The housing according to claim 9 , further comprising a cover that closes the accommodating area, wherein the opening is arranged in a base of the housing and the metallization is arranged at a side at which the cover is arranged.
16. The semiconductor chip according to claim 10 , wherein the semiconductor chip is configured to measure a pressure.
17. A device comprising:
a semiconductor chip;
an injection-molded body, in which an accommodating area for accommodating the semiconductor chip is provided, wherein the injection-molded body has a metallization configured to make electrical contact with the semiconductor chip; and
an opening leading into the accommodating area, wherein the opening is closed by a membrane or a valve.
18. A device comprising:
an injection-molded body having an accommodating area;
a semiconductor chip attached to the accommodating area of the injection-molded body;
a metallization physically attached to the injection-molded body and electrically coupled to the semiconductor chip;
an adhesive attaching the semiconductor chip to the accommodating area; and
a cover closing the accommodating area to hermetically seal the semiconductor chip within the injection-molded body; and
an opening leading into the accommodating area, wherein the opening is closed by a membrane or a valve.
19. The device according to claim 18 , wherein the device is configured to measure pressure.
20. The device according to claim 18 , wherein the metallization comprises a first region within the accommodating area, a second region extending through the injection-molded body and a third region at an outer surface of the injection-molded body.