Method for producing organic light-emitting element
View Patent ↗Method for manufacturing organic EL element including anode, hole injection layer, buffer layer, light-emitting layer, and cathode, layered on substrate in the stated order, and banks defining a light-emission region, and having excellent light-emission characteristics, due to the hole injection layer having excellent hole injection efficiency, being a tungsten oxide layer including an oxygen vacancy structure, formed under predetermined conditions to have an occupied energy level within a binding energy range from 1.8 eV to 3.6 eV lower than a lowest binding energy of a valence band, and after formation, subjected to atmospheric firing at a temperature within 200° C.-230° C. inclusive for a processing time of 15-45 minutes inclusive to have increased film density and improved dissolution resistance against an etching solution, a cleaning liquid, etc., used in a bank forming process.
1. A method for manufacturing an organic light-emitting element, the method comprising:
forming a tungsten oxide layer on a base layer including an anode, the tungsten oxide layer containing tungsten oxide and having a first film density;
firing the tungsten oxide layer to obtain a fired tungsten oxide layer, the fired tungsten oxide layer having a second film density higher than the first film density;
forming a film of barrier wall material on the fired tungsten oxide layer;
forming barrier walls by patterning the film of barrier wall material in a predetermined pattern by using an etching solution, the barrier walls defining an aperture;
forming an organic layer within the aperture, the organic layer containing organic material; and
forming a cathode above the organic layer.
2. The method of claim 1 , wherein
in the forming of the tungsten oxide layer, the tungsten oxide layer is formed to have an oxygen vacancy structure therein.
3. The method of claim 2 , wherein
in the firing of the tungsten oxide layer, the firing is performed to provide the fired tungsten oxide layer with the second film density and thus provide the fired tungsten oxide layer with higher dissolution resistance to the etching solution compared to the tungsten oxide layer.
4. The method of claim 1 , wherein
the first film density is at least 5.4 g/cm 3 and at most 5.7 g/cm 3 , and
the second film density is at least 5.8 g/cm 3 and at most 6.0 g/cm 3 .
5. The method of claim 1 , wherein
in the forming of the tungsten oxide layer, the tungsten oxide layer is formed to have an occupied energy level within a binding energy range from approximately 1.8 electron volts to approximately 3.6 electron volts lower than a lowest binding energy of a valence band, and
in the firing of the tungsten oxide layer, the firing is performed to provide the fired tungsten oxide layer with the second film density and thus provide the fired tungsten oxide layer with higher dissolution resistance to the etching solution compared to the tungsten oxide layer, while ensuring that the fired tungsten oxide layer has an occupied energy level within the binding energy range.
6. The method of claim 1 , wherein
in the forming of the tungsten oxide layer, the tungsten oxide layer is formed such that at least one of an ultraviolet photoelectron spectroscopy spectrum and an X-ray photoelectron spectroscopy spectrum of the tungsten oxide layer exhibits an upward protrusion within a binding energy range from approximately 1.8 electron volts to approximately 3.6 electron volts lower than a lowest binding energy of a valence band, and
in the firing of the tungsten oxide layer, the firing is performed to provide the fired tungsten oxide layer with the second film density and thus provide the fired tungsten oxide layer with higher dissolution resistance to the etching solution compared to the tungsten oxide layer, while ensuring that at least one of an ultraviolet photoelectron spectroscopy spectrum and an X-ray photoelectron spectroscopy spectrum of the fired tungsten oxide layer exhibits an upward protrusion within the binding energy range.
7. The method of claim 1 , wherein
in the forming of the tungsten oxide layer, the tungsten oxide layer is formed such that a differential spectrum obtained by differentiating an ultraviolet photoelectron spectroscopy spectrum of the tungsten oxide layer has a shape that is expressed by a non-exponential function throughout a binding energy range from approximately 1.8 electron volts to approximately 3.6 electron volts lower than a lowest binding energy of a valence band, and
in the firing of the tungsten oxide layer, the firing is performed to provide the fired tungsten oxide layer with the second film density and thus provide the fired tungsten oxide layer with higher dissolution resistance to the etching solution compared to the tungsten oxide layer, while ensuring that a differential spectrum obtained by differentiating an ultraviolet photoelectron spectroscopy spectrum of the fired tungsten oxide layer has a shape that is expressed by a non-exponential function throughout the binding energy range.
8. The method of claim 1 , wherein
in the forming of the tungsten oxide layer, the tungsten oxide layer is formed to include tungsten atoms with a valence of six and tungsten atoms with a valence of five and thus have an oxygen vacancy structure therein, a ratio W 5+ /W 6+ of the number of the tungsten atoms with a valence of five to the number of the tungsten atoms with a valence of six being at least 3.2% and at most 7.4%, and
in the firing of the tungsten oxide layer, the firing is performed to provide the fired tungsten oxide layer with the second film density and thus provide the fired tungsten oxide layer with higher dissolution resistance to the etching solution compared to the tungsten oxide layer, while ensuring that the ratio W 5+ /W 6+ in the fired tungsten oxide layer is at least 3.2% and at most 7.4%.
9. A method for manufacturing an organic light-emitting element, the method comprising:
forming a tungsten oxide layer on a base layer including an anode, the tungsten oxide layer containing tungsten oxide;
firing the tungsten oxide layer to obtain a fired tungsten oxide layer;
forming a film of barrier wall material on the fired tungsten oxide layer;
forming barrier walls by patterning the film of barrier wall material in a predetermined pattern by using an etching solution, the barrier walls defining an aperture;
forming an organic layer within the aperture, the organic layer containing organic material; and
forming a cathode above the organic layer, wherein
in the forming of the tungsten oxide layer, the tungsten oxide layer is formed by introducing a gas comprising an argon gas and an oxygen gas into a chamber of a sputtering device, and under film-forming conditions such that: a total pressure of the gas is greater than 2.7 pascals and at most 7.0 pascals; a partial pressure of the oxygen gas is at least 50% and at most 70% of the total pressure of the gas; and an input power density per unit area of a sputtering target is at least 1 W/cm 2 and smaller than 2.8 W/cm 2 , and
in the firing of the tungsten oxide layer, the firing is performed at a firing temperature of at least 200° C. and at most 230° C., and for a processing time of at least 15 minutes.
10. The method of claim 9 , wherein
in the forming of the tungsten oxide layer, the tungsten oxide layer is formed to have a first film density of at least 5.4 g/cm 3 and at most 5.7 g/cm 3 , and
in the firing of the tungsten oxide layer, the firing is performed to provide the fired tungsten oxide layer with a second film density of at least 5.8 g/cm 3 and at most 6.0 g/cm 3 .