Encapsulation structure for an opto-electronic component
An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.
1. An encapsulation structure for an optoelectronic component, comprising:
a thin-film encapsulation for protecting the optoelectronic component against chemical impurities;
an adhesive layer formed on the thin-film encapsulation, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer; and
a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the cover layer comprises a heat conducting foil or a lacquer layer comprising a polyacrylic protective lacquer.
2. The encapsulation structure as claimed in claim 1 ,
wherein the adhesive layer comprises a curable adhesive material.
3. The encapsulation structure as claimed in claim 2 ,
wherein the curable adhesive material is formed as UV-curing adhesive material.
4. The encapsulation structure as claimed in claim 1 ,
wherein the adhesive layer is formed such that the particle impurities are completely embedded in the adhesive layer.
5. The encapsulation structure as claimed in claim 1 ,
wherein the adhesive layer has a layer thickness of approximately 1 μm to approximately 500 μm.
6. The encapsulation structure as claimed in claim 5 ,
wherein the adhesive layer has a layer thickness of approximately 10 μm to approximately 100 μm.
7. The encapsulation structure as claimed in claim 1 ,
wherein the cover layer comprises a glass layer.
8. The encapsulation structure as claimed in claim 1 ,
wherein a heat conducting foil is applied on or above the cover layer.
9. The encapsulation structure as claimed in claim 1 ,
wherein at least one light coupling-out layer is applied on or above the cover layer.
10. The encapsulation structure as claimed in claim 1 ,
wherein the thin-film encapsulation comprises a layer stack comprising at least one first bather thin-film layer and a second bather thin-film layer formed on the first bather thin-film layer.
11. The encapsulation structure as claimed in claim 1 ,
wherein the adhesive layer comprises scattering particles embedded in the adhesive layer.
12. An encapsulation arrangement, comprising:
an optoelectronic component having at least one functional layer;
an encapsulation structure being formed on or above the at least one functional layer, the encapsulation structure comprising:
a thin-film encapsulation for protecting the optoelectronic component against chemical impurities;
an adhesive layer formed on the thin-film encapsulation, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer; and
a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the cover layer comprises a heat conducting foil or a lacquer layer comprising a polyacrylic protective lacquer.
13. The encapsulation arrangement as claimed in claim 12 ,
wherein the optoelectronic component is an organic optoelectronic component.