Wireless module
View Patent ↗A wireless module includes a first board ( 2 ), in which an electronic component is mounted on one board ( 2 a ) and a ground layer (GND 1 ) is formed on the other board ( 2 b ), a second board ( 3 ) which is laminated on the first board, a connecting member ( 8 ) which electrically connects the first board to the second board, a wiring pad ( 4 ) which electrically connects the first board to the connecting member, and a wiring pad ( 4 b ) which is provided on a bonded surface of the one board and the other board. A signal path of the connecting member has predetermined impedance which is determined depending on a distance between the second wiring pad and the ground layer.
1. A wireless module, comprising:
a first board including at least two-layered boards, in which an electronic component of a wireless circuit is mounted on one board and a ground layer is formed on the other board;
a second board laminated on the first board;
a second wiring pad provided on a bonded face of the one board and the other board and having a second diameter;
a connecting member provided between the first board and the second board at a gap allowing mounting of the electronic component, and forming a portion of an electrical connection between the first board and the second board, and having a third diameter larger than the second diameter of the second wiring pad;
a first wiring pad electrically connecting the first board and the connecting member, and having a first diameter larger than the second diameter of the second wiring pad; and
a first via member provided inside the one board included in the first board, and connected to the first wiring pad and the second wiring pad, and having a fourth diameter smaller than the second diameter of the second wiring pad,
wherein the ground layer is formed on an opposite face of the bonded face.
2. The wireless module according to claim 1 , further comprising:
a third wiring pad electrically connecting the second board and the connecting member, and having the same diameter as the first diameter; and
a fourth wiring pad provided on an opposite side to the third wiring pad of the second board and having a diameter smaller than the second diameter, wherein
a second ground layer is formed on an opposite side to the fourth wiring pad of the second board, and
a second via member provided inside the second board, and connecting to the third wiring pad and the fourth wiring pad, and having the fourth diameter.
3. The wireless module according to claim 1 , further comprising:
a plurality of via members which connect the ground layer to the first board, wherein
the ground layer has a predetermined shape surrounding the first wiring pad.
4. The wireless module according to claim 1 , further comprising:
a first wiring pattern connected to the electronic component;
a fifth wiring pad provided on the bonded face of the one board and the other board, and connected to the first wiring pattern through a second via member; and
a second wiring pattern electrically connecting between the second wiring pad and the fifth wiring pad.
5. The wireless module according to claim 1 , wherein the connecting member is a Cu core ball.