IP Library Granted Patent US 9,123,682
Granted Patent B2
US 9,123,682 · App. 14/131,505 · Granted Sep 1, 2015

Light-emitting device

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Quick Facts
Patent No.
US 9,123,682
App. No.
14/131,505
Granted
Sep 1, 2015
Kind
B2
Abstract

A light-emission device includes a substrate and a G light-emission layer; an R light-emission layer, a B light-emission layer, and a wiring layer made of metal that are each arranged above the substrate. Each of the G light-emission layer, the R light-emission layer, and the B light-emission layer contains light-emission material. An amount of heat that the B light-emission layer generates upon light emission is greater than an amount of heat that the G light-emission layer generates upon light emission. Further, the B light-emission layer directly faces the wiring layer at a facing edge portion.

Claims (48)

1. A light-emission device comprising:

a substrate;

a first light-emission unit above the substrate, the first light-emission unit including a first light-emission layer that contains light-emission material;

a second light-emission unit above the substrate, the second light-emission unit including a second light-emission layer that contains light-emission material and that is adjacent to the first light-emission layer;

a third light-emission unit above the substrate, the third light-emission unit including a third light-emission layer that contains light-emission material and that is adjacent to the first light-emission layer, wherein an amount of heat that the third light-emission layer generates upon light emission is greater than each of an amount of heat that the first light-emission layer generates upon light emission and an amount of heat that the second light-emission layer generates upon light emission; and

a wiring layer above the substrate and adjacent to the third light-emission layer, the wiring layer being made of metal and comprising a line structure or a matrix structure, wherein

the third light-emission layer has a longer facing edge portion than each of the first light-emission layer and the second light-emission layer, a facing edge portion of a given light-emission layer being an edge portion directly facing the wiring layer, or

the third light-emission layer has a larger facing surface portion than each of the first light-emission layer and the second light-emission layer, a facing surface portion of a given light-emission layer being a surface portion directly facing the wiring layer.

2. The light-emission device of claim 1 , wherein

the amount of heat that the second light-emission layer generates upon light emission is greater than the amount of heat that the first light-emission layer generates upon light emission, and

the second light-emission layer has a longer facing edge portion than the first light-emission layer, or

the second light-emission layer has a larger facing surface portion than the first light-emission layer.

3. The light-emission device of claim 1 , wherein

the third light-emission layer has a greater area than each of the first light-emission layer and the second light-emission layer.

4. The light-emission device of claim 3 , wherein

the second light-emission layer has a greater area than the first light-emission layer.

5. The light-emission device of claim 1 , wherein

the third light-emission layer is provided in a pair, and

the first light-emission layer and the second light-emission layer are disposed between the pair.

6. The light-emission device of claim 1 , wherein

the wiring layer comprises the line structure and includes a plurality of line portions, and

the third light-emission layer, the first light-emission layer, and the second light-emission layer are disposed, in the stated order, between each pair of the line portions.

7. The light-emission device of claim 1 , wherein

the substrate includes a drive transistor electrically connected to the first light-emission layer, the second light-emission layer, and the third light-emission layer, and

a portion of the wiring layer exists above the drive transistor.

8. The light-emission device of claim 1 , wherein

the third light-emission layer has lower light-emission efficiency than each of the first light-emission layer and the second light-emission layer.

9. The light-emission device of claim 8 , wherein

the first light-emission layer and the second light-emission layer each contain organic light-emission material of a phosphorescent type as the light-emission material, and

the third light-emission layer contains organic light-emission material of a fluorescent type as the light-emission material.

10. The light-emission device of claim 1 , wherein

the first light-emission layer, the second light-emission layer, and the third light-emission layer each include a pixel electrode made of metal,

a common electrode made of metal is disposed above the first light-emission layer, the second light-emission layer, and the third light-emission layer, the common electrode being continuous between the first light-emission layer, the second light-emission layer, and the third light-emission layer, and

the wiring layer, being at a distance from each of the pixel electrodes, being connected with the common electrode, and being electrically connected with the first light-emission layer, the second light-emission layer, and the third light-emission layer, functions as an auxiliary electrode.

11. A light-emission device comprising:

a substrate;

a first light-emission unit above the substrate, the first light-emission unit including a first light-emission layer that contains light-emission material;

a second light-emission unit above the substrate, the second light-emission unit including a second light-emission layer that contains light-emission material and that is adjacent to the first light-emission layer, wherein an amount of heat that the second light-emission layer generates upon light emission is greater than an amount of heat that the first light-emission layer generates upon light emission; and

a wiring layer above the substrate and adjacent to the second light-emission layer, the wiring layer made of metal and comprising a line structure or a matrix structure, wherein

the second light-emission layer has a longer facing edge portion than the first light-emission layer, a facing edge portion of a given light-emission layer being an edge portion directly facing the wiring layer, or

the second light-emission layer has a larger facing surface portion than the first light-emission layer, a facing surface portion of a given light-emission layer being a surface portion directly facing the wiring layer.

12. A light-emission device comprising:

a substrate;

a phosphorescent light-emission unit above the substrate, the phosphorescent light-emission unit including a phosphorescent light-emission layer that contains light-emission material of a phosphorescent type;

a fluorescent light-emission unit above the substrate, the fluorescent light-emission unit including a fluorescent light-emission layer that contains light-emission material of a fluorescent type and that is adjacent to the phosphorescent light-emission layer, wherein an amount of heat that the fluorescent light-emission layer generates upon light emission is greater than an amount of heat that the phosphorescent light-emission layer generates upon light emission; and

a wiring layer above the substrate and adjacent to the fluorescent light-emission layer, the wiring layer made of metal and comprising a line structure or a matrix structure, wherein

the fluorescent light-emission layer has a longer facing edge portion than the phosphorescent light-emission layer, a facing edge portion of a given light-emission layer being an edge portion directly facing the wiring layer,

or the fluorescent light-emission layer has a larger facing surface portion than the phosphorescent light-emission layer, a facing surface portion of a given light-emission layer being a surface portion directly facing the wiring layer.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2025
From: JDI DESIGN AND DEVELOPMENT G.K.
To: MAGNOLIA BLUE CORPORATION
Reel/Frame 072039/0656 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2024
From: JOLED, INC.
To: JDI DESIGN AND DEVELOPMENT G.K.
Reel/Frame 066382/0619 →
CORRECTION BY AFFIDAVIT FILED AGAINST REEL/FRAME 063396/0671 Recorded Jun 12, 2023
From: JOLED, INC.
To: JOLED, INC.
Reel/Frame 064067/0723 →
SECURITY INTEREST Recorded Apr 20, 2023
From: JOLED, INC.
To: INCJ, LTD.
Reel/Frame 063396/0671 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2015
From: PANASONIC CORPORATION
To: JOLED INC
Reel/Frame 035187/0483 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2014
From: MIZUSAKI, NAOKO; NENDAI, KENICHI
To: PANASONIC CORPORATION
Reel/Frame 032742/0492 →