IP Library Granted Patent US 8,851,769
Granted Patent B2
US 8,851,769 · App. 14/132,592 · Granted Oct 7, 2014

Substrate processing method

Inventor: Koji Kaneyama (Kyoto, JP)
Assignee: Sokudo Co., Ltd.
G03F7/70975G03B27/58H01L21/67745H01L21/68707H01L21/67051H01L21/67046G03F7/70741Y10S134/902
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Quick Facts
Patent No.
US 8,851,769
App. No.
14/132,592
Granted
Oct 7, 2014
Kind
B2
Abstract

A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder.

Claims (23)

1. A substrate processing method for subjecting a substrate to processing using a substrate processing apparatus arranged adjacent to an exposure device,

the substrate processing method comprising the steps of:

forming a photosensitive film made of a photosensitive material on a top surface of the substrate by a photosensitive film forming unit of the substrate processing apparatus;

cleaning a back surface of the substrate by a back surface cleaning unit of the substrate processing apparatus after the formation of the photosensitive film and before exposure processing by the exposure device;

transporting the substrate after the back surface cleaning by the back surface cleaning unit to a temperature adjuster of the substrate processing apparatus while holding the substrate after the back surface cleaning using a first holder of the substrate processing apparatus;

adjusting a temperature of the substrate by the temperature adjuster;

transporting the substrate before the exposure processing from the temperature adjuster to the exposure device while holding the substrate before the exposure processing using a second holder of the substrate processing apparatus; and

transporting the substrate after the exposure processing from the exposure device to a first platform of the substrate processing apparatus while holding the substrate after the exposure processing using a third holder of the substrate processing apparatus.

2. The substrate processing method according to claim 1 , further comprising the step of transporting the substrate after the exposure processing from the first platform to a thermal processing group of the substrate processing apparatus while holding the substrate after the exposure processing using a fourth holder of the substrate processing apparatus.

3. The substrate processing method according to claim 2 , further comprising the step of transporting the substrate placed on a second platform of the substrate processing apparatus to the back surface cleaning unit while holding the substrate placed on the second platform using the third holder, after the formation of the photosensitive film and before the cleaning of the back surface of the substrate by the back surface cleaning unit.

4. The substrate processing method according to claim 3 , further comprising the steps of:

exposing an edge of the substrate by an edge exposure unit of the substrate processing apparatus after the formation of the photosensitive film and before the substrate is placed on the second platform; and

transporting the substrate after the edge exposure by the edge exposure unit to the second platform while holding the substrate after the edge exposure using the fourth holder.

5. The substrate processing method according to claim 4 , further comprising the step of transporting the substrate after the formation of the photosensitive film and before the edge exposure by the edge exposure unit to the edge exposure unit while holding the substrate using a fifth holder of the substrate processing apparatus.

6. The substrate processing method according to claim 2 , further comprising the steps of:

exposing an edge of the substrate by an edge exposure unit of the substrate processing apparatus after the formation of the photosensitive film and before the cleaning of the back surface of the substrate by the back surface cleaning unit; and

transporting the substrate after the edge exposure by the edge exposure unit to the back surface cleaning unit while holding the substrate using the fourth holder.

7. The substrate processing method according to claim 6 , further comprising the step of transporting the substrate after the formation of the photosensitive film and before the edge exposure by the edge exposure unit to the edge exposure unit while holding the substrate using a fifth holder of the substrate processing apparatus.

8. The substrate processing method according to claim 1 , wherein the temperature adjuster includes:

a housing arranged to surround the substrate, and

a gas supplier arranged to supply dry gas into the housing.

9. The substrate processing method according to claim 1 , wherein the third holder is arranged below the first and second holders.

10. The substrate processing method according to claim 1 , wherein the second holder is arranged above the first holder.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2014
From: SOKUDO CO., LTD.
To: SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 033845/0470 →
Priority Claims (1)
JP 2010-072721 · Mar 26, 2010 · national
Continuity (2)
Division 13091711 · Feb 2, 2011
Related Publication 20140104586A1 · Apr 17, 2014