IP Library Granted Patent US 9,385,408
Granted Patent B2
US 9,385,408 · App. 14/135,210 · Granted Jul 5, 2016

Reduced backdrilling with quarter wavelength transmission line stubs

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Quick Facts
Patent No.
US 9,385,408
App. No.
14/135,210
Granted
Jul 5, 2016
Kind
B2
Abstract

Embodiments of the present invention provide for a transmission line stub that includes a via stub of a conductive via. The conductive via includes a via stub and a coupling element, wherein a first transmission line configured to transmit a signal is coupled to the conductive via at the intersection of the via stub and the coupling element. The coupling element is configured to transmit the signal from the first transmission line. A line stub electrically coupled to the via stub, wherein the length of the line stub is selected such that the transmission line stub having a length of the sum of the lengths of the via stub and the line stub is configured to suppress a preselected frequency.

Claims (43)

1. A printed circuit board having a transmission line stub that includes a via stub of a conductive via, the printed circuit board comprising:

the conductive via having the via stub and a coupling element, the via stub extending to an outer surface of the printed circuit board;

a first transmission line configured to transmit a signal coupled to the conductive via at an intersection of the via stub and the coupling element, and

wherein the coupling element is configured to transmit the signal from the first transmission line;

a line stub electrically coupled to the via stub, an upper surface of the line stub being below the outer surface of the printed circuit board,

wherein a length of the line stub is selected such that the transmission line stub having a length including the sum of a length of the via stub and the length of the line stub, is configured to suppress a preselected frequency; and

a second line stub coupled to a second via stub of a second conductive via, the second line stub being a wire attached to a surface land of the second conductive via,

wherein the preselected frequency is a second harmonic of a fundamental frequency,

wherein a first length of the via stub is defined between the transmission line and the line stub, the first length being less than a length of the via stub between the transmission line and an end of the line stub,

wherein a sum of time delays of the line stub and the first length of the via stub is substantially equal to one quarter cycle of the second harmonic of the fundamental frequency,

wherein the line stub is an unterminated circuit trace on a signal plane that is located below an outer insulating layer of the printed circuit board.

2. The printed circuit board of claim 1 , wherein the preselected frequency is a second harmonic of a fundamental frequency.

3. The printed circuit board of claim 2 , wherein the fundamental frequency is based on a data transmission rate for which the transmission line is designed, wherein a sum of time delays of the line stub and the via stub is substantially equal to one quarter cycle of the second harmonic of the fundamental frequency.

4. The printed circuit board of claim 2 , wherein a first length of the via stub is defined between the transmission line and the line stub, the first length being less than a length of the via stub between the transmission line and an end of the line stub, wherein a sum of time delays of the line stub and the first length of the via stub is substantially equal to one quarter cycle of the second harmonic of the fundamental frequency.

5. The printed circuit board of claim 1 , wherein the via stub is positioned in a first material having a first dielectric constant, wherein the line stub is positioned in a second material having a second dielectric constant, wherein the first dielectric constant is different than the second dielectric constant, wherein the first and/or second dielectric constant is determined based on a propagation speed of the signal.

6. The printed circuit board of claim 1 , comprising a second line stub located on an outer surface of the printed circuit board.

7. The printed circuit board of claim 1 , wherein the line stub is an unterminated circuit trace on a signal plane that is located below an outer insulating layer of the printed circuit board.

8. The printed circuit board of claim 1 , wherein the conductive via is a plated through hole.

9. A method of designing a transmission line stub that includes a via stub of a conductive via, the method comprising:

creating a physical layout of a printed circuit board;

determining a designed length of a via stub of a conductive via, wherein the conductive via includes the via stub and a coupling element, the via stub extending to an outer surface of the printed circuit board, wherein a first transmission line designed to transmit a signal is coupled to the conductive via at the intersection of the via stub and the coupling element, and wherein the coupling element is designed to transmit the signal from the first transmission line;

determining a designed length of a line stub, electrically coupled to the via stub, such that the transmission line stub having a length of the sum of the lengths of the via stub and the designed line stub is configured to suppress a preselected frequency, an upper surface of the line stub being below the outer surface of the printed circuit board;

adding the line stub to the via stub in the physical layout;

determining a designed length of a second line stub coupled to a second via stub of a second conductive via, the second line stub being a wire attached to a surface land of the second conductive via,

wherein the preselected frequency is a second harmonic of a fundamental frequency,

wherein the designed length of the via stub is defined between the transmission line and the line stub, the designed length being less than a length of the via stub between the transmission line and an end of the line stub,

wherein a sum of time delays of the line stub and the via stub is substantially equal to one quarter cycle of the second harmonic of the fundamental frequency,

wherein the line stub is an unterminated circuit trace on a signal plane that is located below an outer insulating layer of the printed circuit board.

10. The method of claim 9 , wherein the fundamental frequency is based on a data transmission rate for which the transmission line is designed.

11. The method of claim 9 , wherein the line stub is a microstrip, or the line stub is a stripline.

12. The method of claim 9 , wherein the designed length of the via stub is determined based on a location of the first transmission line in a printed circuit board having the transmission line stub and an amount of space separating the first transmission line and an outer surface of the printed circuit board.

13. The method of claim 9 , wherein the conductive via is a plated through hole.

14. A computer program product for designing a transmission line stub, the computer program product comprising:

one or more computer-readable storage media and program instructions stored on the one or more non-transitory computer-readable media, the program instructions comprising:

program instructions to create a physical layout of a printed circuit board;

program instructions to determine a designed length of a via stub of a conductive via based on a first transmission line coupled to the conductive via at an intersection of the via stub and a coupling element of the conductive via, the via stub extending to an outer surface of the printed circuit board, wherein the coupling element is configured to transmit the signal from the first transmission line;

program instructions to determine a designed length of a line stub electrically coupled to the via stub, based on a preselected frequency, wherein a combined length of the via stub and the line stub is configured to suppress the preselected frequency, an upper surface of the line stub being below the outer surface of the printed circuit board;

program instructions to add the line stub to the via stub in the physical layout; and

program instructions to determine a designed length of a second line stub coupled to a second via stub of a second conductive via, the second line stub being a wire attached to a surface land of the second conductive via,

wherein the preselected frequency is a second harmonic of a fundamental frequency,

wherein the designed length of the via stub is defined between the transmission line and the line stub, the designed length being less than a length of the via stub between the transmission line and an end of the line stub,

wherein a sum of time delays of the line stub and the via stub is substantially equal to one quarter cycle of the second harmonic of the fundamental frequency,

wherein the line stub is an unterminated circuit trace on a signal plane that is located below an outer insulating layer of the printed circuit board.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050298/0360 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2016
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 039872/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2013
From: AO, ERIC R.; DIGNAM, DONALD R.; FLINT, STEPHEN J.; MENG, JIAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 031823/0992 →