IP Library Granted Patent US 9,493,648
Granted Patent B2
US 9,493,648 · App. 14/136,148 · Granted Nov 15, 2016

Thermoplastic resin compositions and molded products including the same

Inventors: In-Chol Kim (Uiwang-si, KR); Chang-Min Hong (Uiwang-si, KR); Ja-Yoon Kim (Uiwang-si, KR); Ji-Eun Park (Uiwang-si, KR)
Assignee: Samsung SDI Co., Ltd.
C08L69/00C08L33/10C08L51/04
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,493,648
App. No.
14/136,148
Granted
Nov 15, 2016
Kind
B2
Abstract

Disclosed is a thermoplastic resin composition including: (A) a polycarbonate resin; (B) an acrylate-styrene-acrylonitrile (ASA) graft copolymer; (C) a random copolymer of an alkyl(meth)acrylate, an aromatic vinyl compound, and a vinyl cyanide compound; and (D) a copolymer of an aromatic methacrylate and a monofunctional unsaturated monomer.

Claims (14)

1. A thermoplastic resin composition, comprising:

(A) about 40 to about 70% by weight of a polycarbonate resin; (B) about 20 to about 40% by weight of an acrylate-styrene-acrylonitrile (ASA) graft copolymer having a shell containing 50 to about 80% by weight styrene and about 20 to 50% by weight acrylonitrile based on the total weight of the shell; (C) about 9 to about 29% by weight of a random copolymer of an alkyl(meth)acrylate, an aromatic vinyl compound, and a vinyl cyanide compound; and (D) greater than or equal to about 0.1% by weight and less than or equal to about 5% by weight of a copolymer of an aromatic methacrylate and a monofunctional unsaturated monomer, each based on the total weight of the thermoplastic resin composition,

wherein the amount of the alkyl(meth)acrylate compound in the random copolymer (C) of an alkyl(meth)acrylate, an aromatic vinyl compound, and a vinyl cyanide compound ranges from about 50% by weight to about 89% by weight based on the total weight of the random copolymer (C) of an alkyl(meth)acrylate, an aromatic vinyl compound, and a vinyl cyanide compound,

wherein the copolymer (D) of an aromatic methacrylate and a monofunctional unsaturated monomer includes a copolymer of an aromatic methacrylate represented by Chemical Formula 1 and a monofunctional unsaturated monomer:

wherein m is an integer of 0 to 10, Y is a single bond, —O—, or —S—, and Ar is phenyl, methyl phenyl, methyl ethyl phenyl, propyl phenyl, methoxy phenyl, cyclohexyl phenyl, chloro phenyl, bromo phenyl, phenyl phenyl, or benzyl phenyl, with the proviso that when m is 0 or 1 then Y is a single bond

wherein the monofunctional unsaturated monomer in the copolymer (D) comprises a (meth)acrylic acid ester, and

wherein the copolymer (D) of an aromatic methacrylate represented by Chemical Formula 1 and the monofunctional unsaturated monomer has a weight average molecular weight of about 8,000 g/mol to about 15,000 g/mol.

2. The thermoplastic resin composition of claim 1 , wherein a sum of the amounts of (C) the random copolymer of an alkyl(meth)acrylate, an aromatic vinyl compound, and a vinyl cyanide compound and (D) the copolymer of an aromatic methacrylate and a monofunctional unsaturated monomer is less than about 30% by weight based on the total weight of the composition.

3. The thermoplastic resin composition of claim 1 , wherein in the random copolymer (C), the alkyl(meth)acrylate compound comprises methyl acrylate, ethyl acrylate, methyl methacrylate, ethyl methacrylate, or a combination thereof, the aromatic vinyl compound comprises styrene, α-methylstyrene, p-methylstyrene, or a combination thereof, and the vinyl cyanide compound comprises acrylonitrile, methacrylonitrile, or a combination thereof.

4. The thermoplastic resin composition of claim 1 , wherein the copolymer (D) of the aromatic methacrylate and the monofunctional unsaturated monomer is a copolymer of about 20 to about 60% by weight of the aromatic methacrylate represented by Chemical Formula 1 and about 40 to about 80% by weight of the monofunctional unsaturated monomer based on the total weight of the copolymer (D).

5. The thermoplastic resin composition of claim 1 , wherein the monofunctional unsaturated monomer in the copolymer (D) further comprise an unsaturated carboxylic acid, a hydroxyl group containing ester, a (meth)acryl amide, or a combination thereof.

6. A molded product prepared from the thermoplastic resin composition of claim 1 .

7. The thermoplastic resin composition of claim 1 , wherein the copolymer (D) of an aromatic methacrylate and a monofunctional unsaturated monomer is a copolymer of the aromatic methacrylate represented by Chemical Formula 1 and a (meth)acrylic acid C1-C4 alkyl ester.

8. The thermoplastic resin composition of claim 1 , wherein the copolymer (D) of an aromatic methacrylate and a monofunctional unsaturated monomer includes a copolymer consisting of an aromatic methacrylate represented by Chemical Formula 1 and a (meth)acrylic acid ester.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2013
From: KIM, IN-CHOL; HONG, CHANG-MIN; KIM, JA-YOON; PARK, JI-EUN
To: CHEIL INDUSTRIES INC.
Reel/Frame 031829/0116 →
Priority Claims (2)
KR 10-2012-0157577 · Dec 28, 2012 · national
KR 10-2013-0037003 · Apr 4, 2013 · national
Continuity (1)
Related Publication 20140187719A1 · Jul 3, 2014