Manufacturing method of nonvolatile memory device and nonvolatile memory device

1. A method of manufacturing a non-volatile memory device comprising steps of:

forming a first electrode layer;

forming a variable resistance material layer comprising an oxygen-deficient metal oxide on the first electrode layer;

forming a second electrode layer on the variable resistance material layer;

forming a first layer on the second electrode layer;

forming, by a first lithography process, a first resist mask extending in a first direction on the first layer;

forming a first pattern extending in the first direction by etching the first layer using the first resist mask;

forming, by a second lithography process, a second resist mask extending in a second direction crossing the first direction, on the first pattern;

forming a hard mask by etching the first pattern using the second resist mask; and

forming a variable resistance element by etching the second electrode layer, the variable resistance material layer and the first electrode layer using the hard mask such that the variable resistance element includes a second electrode, a variable resistance layer and a first electrode;

wherein a width of the second resist mask is greater than a width of the first resist mask to set a focus margin in the second lithography process greater than a focus margin in the first lithography process.

2. The method of manufacturing the non-volatile memory device according to claim 1 , wherein the width of the first resist mask and the width of the second resist mask are 190 nm or less.

3. The method of manufacturing the non-volatile memory device according to claim 1 , wherein the variable resistance element has a shape in which the variable resistance element includes a pair of first linear portions which are opposite to each other and a pair of second linear portions extending in a direction crossing the pair of first linear portions, when viewed from above.

4. The method of manufacturing the non-volatile memory device according to claim 1 , wherein:

in the step of forming the first pattern, the first layer is etched such that the variable resistance material layer is not exposed, and

in the step of forming the hard mask, the first pattern is etched such that the variable resistance material layer is not exposed.

5. The method of manufacturing the non-volatile memory device according to claim 1 , wherein in the step of forming the variable resistance element, at least side surfaces of the variable resistance layer are formed together.

6. The method of manufacturing the non-volatile memory device according to claim 1 , wherein the second electrode layer comprises a precious metal.

7. The method of manufacturing the non-volatile memory device according to claim 1 , wherein when viewed from above after the step of forming the hard mask and before the step of forming the variable resistance element, the second electrode layer is exposed in a region other than the hard mask.

8. The method of manufacturing the non-volatile memory device according to claim 1 , wherein the variable resistance material layer comprises a transition metal oxide or an aluminum oxide.

9. The method of manufacturing the non-volatile memory device according to claim 1 , wherein the variable resistance material layer includes one selected from the group consisting of a tantalum oxide, a hafnium oxide and a zirconium oxide.

10. The method of manufacturing the non-volatile memory device according to claim 1 , wherein a ratio of the width of the second resist mask with respect to a height of the first pattern is greater than 1.

11. The method of manufacturing the non-volatile memory device according to claim 1 , wherein the first layer includes titanium aluminum nitride.

12. The method of manufacturing the non-volatile memory device according to claim 1 , wherein the first layer includes an insulating material.

13. The method of manufacturing the non-volatile memory device according to claim 12 , wherein the first layer includes aluminum oxide.