Low density acoustical panels
View Patent ↗Described herein are building products comprising crimped bicomponent fibers and a non-woven fabric, which demonstrate, inter alia, improved acoustical performance. Methods of making and using the building products are also described.
1. An acoustical substrate, comprising:
about 5 to about 25 wt. % of a crimped bicomponent fiber having a length greater than 3 mm and up to 30 mm; and
about 75 to about 95 wt. % of an inorganic fiber batt;
wherein the density of the acoustical substrate ranges from about 1 lb/ft 3 to about 4 lb/ft 3 .
2. The acoustical substrate of claim 1 , wherein the bicomponent fiber is a heat-fusible bicomponent fiber.
3. The acoustical substrate of claim 1 , wherein the bicomponent fiber comprises a first component and a second component.
4. The acoustical substrate of claim 3 , wherein the first component comprises a thermoplastic polymer.
5. The acoustical substrate of claim 3 , wherein the second component comprises a second thermoplastic polymer.
6. The acoustical substrate of claim 3 , wherein at least one of the first component and the second component is a thermoplastic olefinic polymer.
7. The acoustical substrate of claim 6 , wherein the olefinic polymer of the first component is selected from: polypropylene, a copolymer of propylene and an α-olefin; an ethylene polymer; and polymethyl pentene; and wherein the olefinic polymer of the second component is selected from: polypropylene, a copolymer of propylene and an α-olefin; and an ethylene polymer.
8. The acoustical substrate of claim 1 , wherein the first and second components comprise a polyester.
9. The acoustical substrate of claim 8 , wherein the polyester is selected from polyethylene terephthalate, glycol-modified terephthalate and polybutylene terephthalate.
10. The acoustical substrate of claim 3 , wherein the second component has a melting point higher than that of the first component.
11. The acoustical substrate of claim 3 , wherein the melting point of the first component is not greater than about 150° C.
12. The acoustical substrate of claim 11 , wherein the melting point of the second component is not greater than about 200° C.
13. The acoustical substrate of claim 1 , wherein the crimped bicomponent fiber is in a planar zig-zag or spiral shape.
14. The acoustical substrate of claim 1 , wherein the first component comprises from about 40 to about 60 wt. %, of the bicomponent fiber and the second component comprises from about 40 to about 60 wt. % of the bicomponent fiber.
15. The acoustical substrate of claim 3 , wherein the second component comprises a plurality of filaments.
16. The acoustical substrate of claim 1 , comprising from about 12 to about 17 wt. % of a bicomponent fiber.
17. The acoustical substrate of claim 16 , comprising from about 83 to about 88 wt. % of mineral wool.
18. The acoustical substrate of claim 1 , wherein the substrate is a ceiling tile.
19. The acoustical substrate of claim 1 , further comprising a scrim.
20. An acoustical substrate, comprising:
about 5 to about 25 wt. % of a crimped bicomponent fiber having a length ranging from about 6 mm to about 30 mm; and
about 75 to about 95 wt. % of an inorganic fiber batt;
wherein the bicomponent fiber comprises a first component and a second component and the second component has a melting point higher than that of the first component.