Cooling for electronic equipment
View Patent ↗An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.
1. An electronic device, comprising:
a housing with an exhaust port and an intake port, wherein the exhaust port is located on a first side of the housing and the intake port is located on a second side of the housing, wherein the first side and the second side are substantially opposite each other;
a heat source contained in said housing;
a heat transfer unit connected to said heat source;
a first radiator located adjacent to said exhaust port, wherein said first radiator is connected to an exhaust-side of said heat transfer unit;
a first blower fan, wherein said first blower fan discharges heat transmitted to said first radiator through said exhaust port; and
a second radiator located adjacent to said intake port, wherein said second radiator is connected to an intake-side of said heat transfer unit, wherein said intake-side of said heat transfer unit is provided integrally with said exhaust-side of said heat transfer unit.
2. The electronic device of claim 1 , wherein the heat source is an arithmetic processor.
3. The electronic device of claim 1 , wherein the heat source is a central processing unit.
4. The electronic device of claim 1 , wherein the second radiator is formed integrally with the heat transfer unit.
5. The electronic device of claim 1 , wherein the housing has a front opening that contains a display.
6. The electronic device of claim 1 , wherein the intake port is located in the center of a lower edge of the housing.
7. The electronic device of claim 1 , further comprising an extended device to which the electronic device attaches comprising: a second blower fan, wherein said second blower fan supplies air to the electronic device via the intake port when said extended device is attached to said electronic device.
8. The electronic device of claim 1 , wherein said intake-side of said heat transfer unit transmits heat to said second radiator.
9. The electronic device of claim 1 , wherein said heat transfer unit comprises a heat sink.
10. The electronic device of claim 1 , wherein said first blower fan comprises a centrifugal fan.
11. An electronic device, comprising:
a housing including a processor and a memory;
said housing configured with an exhaust port and an intake port, wherein the exhaust port is located on a first side of the housing and the intake port is located on a second side of the housing, wherein the first side and the second side are substantially opposite each other;
a heat transfer unit thermally coupled to said processor;
a first radiator located adjacent to said intake port and thermally coupled to an intake-side of said heat transfer unit; and
a second radiator thermally coupled to an exhaust-side of said heat transfer unit and disposed proximate to the exhaust port, wherein said exhaust-side of said heat transfer unit is provided integrally with said intake-side of said heat transfer unit.
12. The electronic device of claim 11 , further comprising a fan that circulates cooling air from said intake port to said exhaust port.
13. The electronic device of claim 11 , further comprising an extended device to which the electronic device attaches, comprising: a second blower fan, wherein said second blower fan supplies air to the electronic device via the intake port when said extended device is attached to said electronic device.
14. The electronic device of claim 11 , wherein said heat transfer unit comprises a heat sink.
15. A method, comprising:
disposing a processor and a memory within a housing of an electronic device;
the housing configured with an exhaust port and an intake port, wherein the exhaust port is located on a first side of the housing and the intake port is located on a second side of the housing, wherein the first side and the second side are substantially opposite each other;
thermally coupling a first radiator to said processor using a heat transfer unit, said first radiator being disposed adjacent to said intake port and a intake-side of said heat transfer unit; and
thermally coupling a second radiator to said processor using a heat transfer unit, said second radiator being disposed proximate to the exhaust port and an exhaust-side of said heat transfer unit, wherein said exhaust-side of said heat transfer unit is provided integrally with said intake-side of said heat transfer unit.
16. The method of claim 15 , further comprising incorporating a fan into the housing, wherein the fan circulates cooling air from said intake port to said exhaust port.
17. The method of claim 15 , further comprising disposing a second blower fan within a housing of an extended device to which the electronic device attaches, wherein said second blower fan supplies air to the electronic device via the intake port when said extended device is attached to said electronic device.