LIGHT-EMITTING DEVICE
A light-emitting device includes a semiconductor light-emitting element and a fluorescent member which emits fluorescent light when irradiated with light from the semiconductor light-emitting element. The fluorescent member includes (i) oxygen-proof resin having no permeability to oxygen and (ii) resin which includes semiconductor particles having different excitation fluorescence spectra according to particle diameter and is encased in the oxygen-proof resin.
1 . A light-emitting device comprising:
a semiconductor light-emitting element; and
a fluorescent member which emits fluorescent light when irradiated with light from the semiconductor light-emitting element,
wherein the fluorescent member includes: a first region including semiconductor particles having different excitation fluorescence spectra according to particle diameter; and a second region having no permeability to oxygen, and
the first region is encased in the second region.
2 . The light-emitting device according to claim 1 ,
wherein a difference between a coefficient of thermal expansion of the first region and a coefficient of thermal expansion of the second region is 10% or less.
3 . The light-emitting device according to claim 1 ,
wherein the second region is divided into a plurality of third regions having no permeability to oxygen.
4 . The light-emitting device according to claim 1 ,
wherein the first region is composed of only the semiconductor particles.
5 . The light-emitting device according to claim 3 , further comprising
a housing in which the semiconductor light-emitting element is mounted,
wherein the second region is located on a surface of the semiconductor light-emitting element, and the first region is located between the third regions.
6 . The light-emitting device according to claim 5 ,
wherein the third regions are in contact with the first region and encase the first region.
7 . A light-emitting device comprising:
a semiconductor light-emitting element;
a fluorescent member which emits fluorescent light when irradiated with light from the semiconductor light-emitting element; and
a metal layer in contact with the fluorescent member,
wherein the fluorescent member includes: a first region including semiconductor particles having different excitation fluorescence spectra according to particle diameter; and a second region having no permeability to oxygen, and
the first region is encased in the second region and the metal layer.
8 . A method of manufacturing a light-emitting device, the method comprising:
molding a second member in a housing in which a semiconductor light-emitting element is provided, inserting an injecting pipe in the second member, and injecting a first member including florescent material into the second member through the injecting pipe; and
removing the injecting pipe after the injecting of the first member, and encasing the first member with the second member by filling, with the second member, a hole made in the second member by the injecting pipe inserted into the second member,
wherein the first member emits fluorescent light when irradiated with light from the semiconductor light-emitting element and includes semiconductor particles having different excitation fluorescence spectra according to particle diameter, and
the second member has no permeability to oxygen.