IP Library Granted Patent US 9,167,725
Granted Patent B2
US 9,167,725 · App. 14/140,508 · Granted Oct 20, 2015

Backplane structure and server system utilizing the same

Inventors: Richard S. Chen (San Jose, CA); Lawrence H. Liang (San Jose, CA); Lawrence K. W. Lam (San Jose, CA); Shen Ping (San Jose, CA)
Assignee: SUPER MICRO COMPUTER INC.
H05K7/20718G06F1/20H05K7/1451H05K7/20H05K7/20581H05K7/20727
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Quick Facts
Patent No.
US 9,167,725
App. No.
14/140,508
Granted
Oct 20, 2015
Kind
B2
Abstract

A server system utilizing a backplane structure comprises first and second hard disk modules; a first backplane comprising a first wiring board comprising air vents and passive components and a second wiring board connected to a bottom portion of the first wiring board at a first angle and comprising first active components; and a second backplane comprising a third wiring board comprising second air vents and second passive components and a fourth wiring board connected to a bottom portion of the third wiring board at a second angle and comprising second active components thereon; wherein the first and second backplanes are disposed between the first and second hard disk modules; the first wiring board is directly corresponding to the first hard disk module; the third wiring board is directly corresponding to the second hard disk module; the first backplane is higher than the second backplane.

Claims (20)

1. A backplane structure, utilized for controlling and managing a hard disk module in a server system, comprising:

a first wiring board, having a first surface and a second surface, comprising a plurality of air vents and a plurality of passive components, wherein the first surface includes at least one connector; and

a second wiring board, connected to a bottom portion of the first wiring board through the connector, having a third surface and a fourth surface, and comprising a plurality of active components,

wherein the second surface is opposed to the third surface at a first angle.

2. The backplane structure according to claim 1 , wherein the first angle is 90 degree.

3. The backplane structure according to claim 1 , wherein the plurality of air vents are arranged in a matrix form.

4. A server system utilizing a backplane structure, comprising:

a hard disk module; and

a backplane comprising (1) a first wiring board, with a first surface and a second surface, comprising a plurality of air vents and a plurality of passive components, wherein the first surface includes at least one connector; and (2) a second wiring board, connected to a bottom portion of the first wiring board through the connector, having a third surface and a fourth surface, and comprising a plurality of active components, wherein the second surface is opposed to the third surface at a first angle;

wherein the first surface of the first wiring board of the backplane is directly corresponding to the hard disk module.

5. The server system according to claim 4 , wherein the first angle is 90 degree.

6. The server system according to claim 4 , wherein the plurality of air vents are arranged in a matrix form.

7. A server system utilizing a backplane structure, comprising:

a first hard disk module;

a second hard disk module;

a first backplane, connecting to the first hard disk module, comprising (1) a first wiring board, with a first surface and a second surface, comprising a plurality of first air vents and a first plurality of passive components, wherein the first surface includes at least one first connector; and (2) a second wiring board, connected to a bottom portion of the first wiring board through the first connector, having a third surface and a fourth surface, and comprising a plurality of first active components, wherein the second surface is opposed to the third surface at a first angle;

a second backplane, connecting to the first hard disk module, comprising (1) a third wiring board, with a fifth surface and a sixth surface, comprising a plurality of second air vents and a second plurality of passive components, wherein the fifth surface having at least one second connector; and (2) a fourth wiring board, connected to a bottom portion of the third wiring board through the second connector, having a seventh surface and an eighth surface, and comprising a plurality of second active components, wherein the sixth surface is opposed to the seventh surface at a second angle;

wherein the first backplane and the second backplane are disposed between the first hard disk module and the second hard disk module; the first surface of the first wiring board of the first backplane is directly corresponding to the first hard disk module; the fifth surface of the third wiring board of the second backplane is directly corresponding to the second hard disk module; and a first height of the first backplane is higher than a second height of the second backplane.

8. The server system utilizing a backplane structure according to claim 7 , wherein the first angle and the second angle are 90 degree.

9. The server system utilizing a backplane structure according to claim 7 , wherein the first and second air vents are arranged in a matrix form.

Assignments (4)
SECURITY INTEREST Recorded Jan 20, 2026
From: SUPER MICRO COMPUTER, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 074447/0643 →
RELEASE OF SECURITY INTEREST Recorded Nov 22, 2024
From: BANK OF AMERICA, N.A., AS AGENT
To: SUPER MICRO COMPUTER, INC.
Reel/Frame 069436/0469 →
SECURITY INTEREST Recorded Apr 27, 2018
From: SUPER MICRO COMPUTER, INC
To: BANK OF AMERICA, N.A, AS ADMINSTRATIVE AGENT
Reel/Frame 046029/0940 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 25, 2013
From: CHEN, RICHARD S.; LIANG, LAWRENCE H.; LAM, LAWRENCE K.W.; PING, SHEN
To: SUPER MICRO COMPUTER INC.
Reel/Frame 031846/0824 →
Continuity (1)
Related Publication 20150181768A1 · Jun 25, 2015